Rogers RT/duroid 6006 10mil 25mil 50mil substrate raw material Double-Sided Copper Clad Laminate for Patch Antennas
Double-Sided Copper Clad Laminate with Rogers RT/duroid 6006
The double-sided copper clad laminate constructed with Rogers RT/duroid 6006 is optimized for microwave, RF, and high-frequency circuit applications. With its high dielectric constant (Dk = 6.15 ± 0.15) and ultra-low dissipation factor (Df = 0.0027), this laminate is ideal for compact designs and low-loss performance in demanding environments. The 0.35mm finished thickness and 10mil RT/duroid 6006 substrate make this material suitable for X-band and below frequency applications where precision and repeatability are critical.
Key Construction Details
| Parameter | Specification |
| Base Material | Rogers RT/duroid 6006 |
| Layer Count | 2 Layers |
| Board Dimensions | 43mm x 107.5mm ± 0.15mm |
| Finished Thickness | 0.35mm |
| Copper Thickness | 1oz (35μm) on both layers |
| Dielectric Thickness | 10mil (0.254mm) |
| Minimum Trace/Space | 4/4 mils |
| Minimum Hole Size | 0.20mm |
| Via Plating Thickness | 20μm |
| Surface Finish | Immersion Gold |
| Solder Mask | None (Top and Bottom) |
| Silkscreen | Top: Black, Bottom: None |
| Thermal Decomposition (Td) | >500°C |
| Electrical Testing | 100% tested prior to shipment |
Introduction to Rogers RT/duroid 6006
Rogers RT/duroid 6006 laminates are ceramic-PTFE composites designed for microwave and high-frequency circuit applications. Their high dielectric constant (Dk) enables circuit size reduction, while their tight Dk control ensures repeatable performance. The low dissipation factor makes them suitable for X-band frequencies and below, ensuring minimal signal loss in high-frequency designs.
Why Choose Rogers RT/duroid 6006?
- High Dielectric Constant: Dk = 6.15 ± 0.15 at 10GHz, enabling compact designs and higher component density.
- Low Loss Performance: With a dissipation factor of 0.0027, the material supports efficient signal transmission and low insertion loss.
- Environmental Stability: The laminate features low moisture absorption (0.05%) and high thermal decomposition temperature (Td > 500°C), ensuring reliability in harsh conditions.
- Ease of Processing: Compatible with standard fabrication techniques, including plating and etching.
Key Features of Rogers RT/duroid 6006 Copper Clad Laminate
- Dielectric Constant (Dk): 6.15 ± 0.15 at 10GHz, offering consistent electrical properties for high-frequency performance.
- Low Dissipation Factor (Df): 0.0027 at 10GHz, ensuring minimal signal loss and high efficiency in RF circuits
- Thermal Stability: High decomposition temperature (Td > 500°C) ensures durability in high-power designs.
- Low Moisture Absorption: 0.05%, making it ideal for high-humidity environments without compromising performance.
- Tight Control of Thickness and Dk: Ensures repeatable circuit performance, critical for high-frequency and aerospace applications.
- Lead-Free Process Compatibility: Fully compatible with modern environmentally friendly manufacturing standards.
- Flammability Rating: UL 94-V0, ensuring safety and reliability in various applications.
- Dimensional Stability: With a CTE of 47 ppm/°C (X-axis) and 34 ppm/°C (Y-axis), the laminate provides mechanical stability during thermal cycling.
Some Typical Applications:
- Patch Antennas
- Satellite Communications Systems
- Power Amplifiers
- Aircraft Collision Avoidance Systems
- Ground Radar Warning Systems
Conclusion
The double-sided copper clad laminate with Rogers RT/duroid 6006 is a high-performance material optimized for microwave, RF, and high-frequency applications. With its high dielectric constant, low dissipation factor, and excellent environmental resistance, it is ideal for compact, high-frequency designs in aerospace, satellite communications, and radar systems. While its higher cost may limit its use in general-purpose designs, its superior performance ensures reliable operation for advanced electronic systems.
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