F4BTM350 2-layer PCB 3.048mm 120mil substrate core laminate 35um copper weight using in Microwave and RF Systems
F4BTM350 PCB 2-layer 3.048mm 120mil Thick
We are excited to present our 2-layer PCB, built with F4BTM350 laminate, a material engineered for demanding microwave, RF, and radar system applications. This PCB combines high dielectric constant, low loss, and excellent thermal conductivity, making it ideal for high-frequency designs. Below is a detailed breakdown of its construction, features, and applications.
PCB Construction Details
| Parameter | Specification |
| Base Material | F4BTM350 |
| Layer Count | 2-layer |
| Board Dimensions | 328mm x 84.08mm ± 0.15mm |
| Minimum Trace/Space | 5/7 mils |
| Minimum Hole Size | 0.4mm |
| Blind/Buried Vias | None |
| Finished Board Thickness | 3.1mm |
| Copper Weight | 1oz (1.4 mils) outer layers |
| Via Plating Thickness | 20μm |
| Surface Finish | Immersion Gold |
| Top Solder Mask | Black |
| Bottom Solder Mask | None |
| Top Silkscreen | White |
| Bottom Silkscreen | None |
| Electrical Testing | 100% tested prior to shipment |
| Quality Standard | IPC-Class-2 |
PCB Stackup
The F4BTM350 core, with its 3.048mm thickness (120mil), ensures low loss and high thermal stability, making it suitable for high-frequency applications. The stackup includes:
| Layer | Material | Thickness |
| Copper Layer 1 | Copper Foil | 35μm |
| Core Material | F4BTM350 Core | 3.048mm |
| Copper Layer 2 | Copper Foil | 35μm |
PCB Statistics
This PCB is designed for compact, high-performance designs with the following specifications:
| Parameter | Value |
| Components | 58 |
| Total Pads | 139 |
| Thru Hole Pads | 97 |
| Top SMT Pads | 42 |
| Bottom SMT Pads | 0 |
| Vias | 68 |
| Nets | 2 |
| Supplied Artwork | Gerber RS-274-X |
About F4BTM350 Material
The F4BTM350 laminate, developed by Wangling, is a high-performance material made from fiberglass cloth, nano-ceramic filling, and polytetrafluoroethylene (PTFE) resin. This advanced formulation delivers superior dielectric properties, low loss, and thermal stability, making it ideal for high-frequency applications in telecommunications, aerospace, and defense.
Key Features of F4BTM350:
- Dielectric Constant (Dk): 3.5 ± 0.07 at 10GHz, ensuring precise impedance control.
- Dissipation Factor (Df): 0.0025 at 10GHz, enabling minimal signal loss.
- Thermal Coefficient of Dk: -60 ppm/°C (from -55°C to 150°C), ensuring stability across temperature ranges.
- Coefficient of Thermal Expansion (CTE): X-axis: 10 ppm/°C. Y-axis: 12 ppm/°C. Z-axis: 51 ppm/°C.
- Moisture Absorption: ≤ 0.05%, providing reliable performance in humid environments.
- Thermal Conductivity: Enhanced due to nano-ceramic filling, ensuring efficient heat dissipation.
- Flammability: UL-94 V0 rated for safety.
- Comparative Tracking Index (CTI): >600V, Grade 0.
Applications
- Microwave and RF Systems
- Phase Shifters
- Power Dividers, Couplers, and Combiners
- Feed Networks
- Phase-Sensitive Antennas and Phased-Array Antennas
- Satellite Communications
- Base Station Antennas
Conclusion
The 2-layer PCB with F4BTM350 core is a robust and cost-efficient solution for high-frequency applications. Its combination of low loss, thermal stability, and excellent mechanical properties makes it an ideal choice for industries such as telecommunications, aerospace, and defense.
For more information or to request a quote, contact us today. We are committed to delivering high-quality PCBs that meet the most demanding requirements of your applications!
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