2-layer RO4003C PCB built on 8mil laminate substarte with Immersion Silver black soldermask using in Radar and Sensors
2-Layer PCB with Rogers RO4003C Core
We are proud to offer our 2-layer PCB, constructed with Rogers RO4003C, a high-performance laminate designed for RF and microwave applications. With its low dielectric loss, stable dielectric constant, and cost-effective manufacturability, this PCB is ideal for performance-sensitive and high-volume applications such as cellular base stations, automotive radar, and satellite systems.
PCB Construction Details
This PCB is precisely engineered to meet the demands of high-frequency and high-reliability applications. Below are the construction specifications:
| Parameter | Specification |
| Base Material | Rogers RO4003C |
| Layer Count | 2-layer |
| Board Dimensions | 54mm x 58mm ± 0.15mm |
| Minimum Trace/Space | 4/6 mils |
| Minimum Hole Size | 0.2mm |
| Blind/Buried Vias | None |
| Finished Board Thickness | 0.3mm |
| Copper Weight | 1oz (1.4 mils) outer layers |
| Via Plating Thickness | 20μm |
| Surface Finish | Immersion Silver |
| Top Solder Mask | None |
| Bottom Solder Mask | None |
| Top Silkscreen | Black |
| Bottom Silkscreen | None |
| Electrical Testing | 100% tested prior to shipment |
| Quality Standard | IPC-Class-2 |
PCB Stackup
The RO4003C core, with its 8mil thickness (0.203mm), provides low loss, mechanical stability, and thermal reliability for high-frequency applications. The stackup is as follows:
| Layer | Material | Thickness |
| Copper Layer 1 | Copper Foil | 35μm (1oz) |
| Core Material | Rogers RO4003C Core | 0.203mm (8mil) |
| Copper Layer 2 | Copper Foil | 35μm (1oz) |
PCB Statistics
This PCB is designed for compact, performance-critical designs, with the following specifications:
| Parameter | Value |
| Components | 14 |
| Total Pads | 22 |
| Thru Hole Pads | 12 |
| Top SMT Pads | 10 |
| Bottom SMT Pads | 0 |
| Vias | 19 |
| Nets | 2 |
| Supplied Artwork | Gerber RS-274-X |
About Rogers RO4003C Material
The Rogers RO4003C laminate(https://www.circuitboardpcbs.com/sale-53614722-ro4003c-high-frequency-pcb-with-1-layer-2-layer-multi-layer-hybrid-type-mixed.html) is a woven glass-reinforced hydrocarbon/ceramic composite, offering the electrical performance of PTFE laminates combined with the manufacturability of epoxy/glass materials. It provides low dielectric loss, tight DK tolerance, and excellent dimensional stability, making it ideal for high-frequency applications.
Key Features of RO4003C:
- Dielectric Constant (Dk): 3.38 ± 0.05 at 10 GHz, ensuring consistent performance across frequencies.
- Dissipation Factor (Df): 0.0027 at 10 GHz (0.0021 at 2.5 GHz), minimizing signal loss.
- Thermal Coefficient of Dk: +40 ppm/°C, providing excellent stability across operating temperatures.
- Thermal Conductivity: 0.71 W/mK, supporting efficient heat dissipation.
- Coefficient of Thermal Expansion (CTE): X-axis: 11 ppm/°C. Y-axis: 14 ppm/°C. Z-axis: 46 ppm/°C.
- Moisture Absorption: 0.06%, ensuring consistent performance in humid environments.
Applications with Rogers RO4003C
RF Identification Tags (RFID)
Automotive Radar and Sensors
LNBs for Direct Broadcast Satellites
Microstrip Patch Antennas
Conclusion
The 2-layer PCB with Rogers RO4003C core is an ideal solution for high-frequency applications requiring low loss, dimensional stability, and thermal reliability. Its advanced material properties and cost-effective manufacturability make it an excellent choice for industries such as telecommunications, automotive, aerospace, and satellite communication.
For more information or to request a quote, contact us today. We are committed to delivering high-quality PCBs that meet your exact requirements!
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