TLY-5 2 layer PCB bulit on 10mil laminate substrate with 35um copper Immersion Gold using in LNBs, LNAs, LNCs
2-Layer PCB with TLY-5 Core
Our 2-layer PCB, built on TLY-5 laminate(https://www.circuitboardpcbs.com/sale-14171952-taonic-tly-5-tly-5-l-tly-3-tly-3ff-high-frequency-pcb-coating-with-hasl-immersion-gold-osp-and-tin.html), is an ideal solution for high-frequency and millimeter-wave applications. With its low dielectric constant (Dk), ultra-low dissipation factor (Df), and dimensional stability, this PCB is specifically designed for automotive radar, satellite communications, and Ka/E/W band applications.
PCB Construction Details
| Parameter | Specification |
| Base Material | TLY-5 |
| Layer Count | 2 layers |
| Board Dimensions | 55mm x 50mm ± 0.15mm |
| Minimum Trace/Space | 6/8 mils |
| Minimum Hole Size | 0.2mm |
| Blind/Buried Vias | None |
| Finished Board Thickness | 0.3mm |
| Copper Weight | 1oz (1.4 mils) outer layers |
| Via Plating Thickness | 20μm |
| Surface Finish | Immersion Gold |
| Top Solder Mask | None |
| Bottom Solder Mask | None |
| Top Silkscreen | None |
| Bottom Silkscreen | None |
| Electrical Testing | 100% tested prior to shipment |
| Accepted Standard | IPC-Class-2 |
PCB Stackup
The 10mil (0.254mm) TLY-5 laminate ensures low loss, dimensional stability, and consistent dielectric performance. The PCB stackup is as follows:
| Layer | Material | Thickness |
| Copper Layer 1 | Finished Copper | 35μm (1oz) |
| Core Material | TLY-5 | 0.254mm (10mil) |
| Copper Layer 2 | Finished Copper | 35μm (1oz) |
This stackup supports high-frequency signal integrity, stable impedance, and low insertion loss.
PCB Statistics
Designed for compact, high-frequency circuits, this PCB’s specifications are:
| Parameter | Value |
| Components | 9 |
| Total Pads | 41 |
| Thru Hole Pads | 23 |
| Top SMT Pads | 18 |
| Bottom SMT Pads | 0 |
| Vias | 17 |
| Nets | 2 |
| Supplied Artwork | Gerber RS-274-X |
About TLY-5 Material
The TLY-5 laminate is a dimensionally stable, low-loss PTFE-based material reinforced with lightweight woven fiberglass. This construction makes it highly suitable for high-frequency and high-volume manufacturing, especially in millimeter-wave frequency applications.
Key Features of TLY-5:
- Dielectric Constant (Dk): 2.2 ± 0.02 at 10GHz/23°C, ensuring precise and consistent impedance control.
- Dissipation Factor (Df): 0.0009 at 10GHz, delivering ultra-low loss for high-frequency signals.
- Density (Specific Gravity): 2.19 g/cm³, providing lightweight construction.
- Moisture Absorption: 0.02%, ensuring stable performance even in humid environments.
- Coefficient of Thermal Expansion (CTE): X-axis: 26 ppm/°C, Y-axis: 15 ppm/°C, Z-axis: 217 ppm/°C
Applications
The TLY-5-based PCB is perfect for a range of high-frequency and RF applications, including:
- Automotive Radar
- Satellite and Cellular Communications
- Power Amplifiers
- RF Components
- Aerospace Applications
- Ka, E, and W Band Applications
Conclusion
The 2-layer PCB with TLY-5 laminate offers exceptional performance for high-frequency and millimeter-wave applications. Its low dissipation factor, tight dielectric constant tolerance, and dimensionally stable construction make it a go-to solution for industries like automotive, aerospace, and telecommunications.
For more information or to request a quote, contact us today. We are committed to providing high-quality PCBs tailored to your specific requirements!
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