TMM4 2-Layer PCB built on 15mil substrate with Immersion Gold Finish both side 35um copper weight in RF and Microwave Circuitry
15mil TMM4 2-Layer PCB with Immersion Gold Finish
The 15mil TMM4 2-Layer PCB is a premium-quality circuit board designed for high-frequency and microwave applications. Built with Rogers TMM4 laminate, this custom-designed PCB offers exceptional reliability, low signal loss, and unmatched mechanical stability. Its compact size, robust construction, and high-performance material make it an ideal choice for RF and microwave circuitry, satellite communication systems, GPS antennas, and more.
Engineered for precision and durability, this PCB features Immersion Gold surface finish for superior solderability and conductivity. It adheres to the IPC-Class-2 standard, ensuring consistent quality and reliability for demanding applications. The 15mil TMM4 core provides low dissipation and excellent dielectric properties, making it suitable for high-frequency designs where signal integrity is critical.
Key Construction Details
| Parameter | Specification |
| Base Material | Rogers TMM4 |
| Layer Count | 2 layers |
| Board Dimensions | 102mm x 85mm, tolerance: +/- 0.15mm |
| Finished Board Thickness | 0.5mm |
| Copper Weight | 1oz (1.4 mils) outer layers |
| Minimum Trace/Space | 5/7 mils |
| Minimum Hole Size | 0.4mm |
| Via Plating Thickness | 20 μm |
| Surface Finish | Immersion Gold |
| Solder Mask | None (top and bottom) |
| Silkscreen | None (top and bottom) |
| Electrical Testing | 100% tested prior to shipment |
The PCB is designed without solder masks or silkscreens, prioritizing performance and simplicity. This ensures a cleaner, more direct layout for high-frequency applications.
PCB Stackup
Copper Layer 1: 35 μm (1oz)
Rogers TMM4 Core: 0.381mm (15mil)
Copper Layer 2: 35 μm (1oz)
What is Rogers TMM4 Laminate?
The TMM4 laminate is a high-performance, thermoset microwave material specifically designed for RF and microwave applications. It combines the benefits of ceramic and PTFE laminates without requiring specialized processing techniques. The TMM4 material is composed of a ceramic-filled hydrocarbon polymer that offers exceptional mechanical and electrical properties.
Key Features of TMM4 Material:
| Property | Value |
| Dielectric Constant (Dk) | 4.50 ± 0.045 |
| Dissipation Factor | 0.0020 at 10GHz |
| Thermal Coefficient of Dk | 15 ppm/°K |
| Thermal Conductivity | 0.7 W/mK |
| Moisture Absorption | 0.07%-0.18% |
| Decomposition Temperature | 425°C (TGA) |
| CTE (Coefficient of Thermal Expansion) | x: 16 ppm/°K, y: 16 ppm/°K, z: 21 ppm/°K |
Benefits of the 15mil TMM4 PCB
- Low Signal Loss: The low dissipation factor (0.0020 at 10GHz) ensures minimal signal attenuation, making it ideal for RF and microwave circuitry.
- High Thermal Stability: With a decomposition temperature of 425°C, the PCB performs exceptionally well in high-heat environments.
- Reliable Wire-Bonding: The thermoset resin-based TMM4 material prevents pad lifting and substrate deformation during wire-bonding.
- Durable Via Plating: The 20 μm via plating thickness ensures high reliability for plated-through holes.
- Ease of Processing: TMM4 laminates can be processed using standard PWB techniques, reducing manufacturing complexity compared to PTFE materials.
Applications
RF and Microwave Circuitry
Satellite Communication Systems
Power Amplifiers and Combiners
GPS and Patch Antennas
Dielectric Polarizers and Lenses
Chip Testers
Conclusion
The 15mil TMM4 2-Layer PCB with Immersion Gold finish is a superior choice for engineers and manufacturers seeking high reliability, low signal loss, and excellent thermal stability in RF and microwave designs. Its compact design, advanced TMM4 laminate, and precise construction make it suitable for a wide range of demanding applications, from satellite communications to GPS antennas and power amplifiers.
With worldwide availability and compliance with IPC-Class-2 standards, this PCB is ready to meet the needs of advanced high-frequency systems.
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