Rogers AD300D 40mil laminate is used to manufacture double-sided printed circuit boards.
40mil AD300D 2-Layer PCB with EPIG (Electroless Palladium Immersion Gold) Finish
The 40mil AD300D Double-Sided PCB is a high-performance printed circuit board designed to meet the requirements of advanced RF and microwave applications. Built with ceramic-filled, PTFE-based AD300D laminates, this PCB provides controlled dielectric properties, low loss, and excellent passive intermodulation (PIM) performance. With its EPIG (nickel-free) finish, this PCB offers enhanced signal integrity and solderability, making it ideal for wireless communication systems, antennas, and automotive telematics.
PCB Construction Details
| Specification | Details |
| Base Material | AD300D |
| Layer Count | 2-layer rigid PCB |
| Board Dimensions | 67mm x 102.6mm ± 0.15mm |
| Finished Thickness | 1.2mm |
| Copper Thickness | 1oz (35μm) on both layers |
| Surface Finish | EPIG (Electroless Palladium Immersion Gold) |
| Minimum Trace/Space | 4/6 mils |
| Minimum Hole Size | 0.4mm |
| Via Plating Thickness | 20μm |
| Solder Mask | None |
| Silkscreen | None |
| Electrical Testing | 100% prior to shipment |
| Quality Standard | IPC-Class-2 |
PCB Stackup
| Layer | Material | Thickness |
| Copper Layer 1 | Copper Foil (1oz) | 35μm |
| Core | AD300D (40mil) | 1.016mm |
| Copper Layer 2 | Copper Foil (1oz) | 35μm |
PCB Statistics
| Parameter | Value |
| Components | 15 |
| Total Pads | 41 |
| Thru-Hole Pads | 29 |
| Top SMT Pads | 12 |
| Bottom SMT Pads | 0 |
| Vias | 36 |
| Nets | 2 |
The PCB is manufactured using Gerber RS-274-X artwork, ensuring precise production and compatibility with modern fabrication processes.
Material Overview: AD300D
AD300D laminates are PTFE-based, ceramic-filled materials designed for RF and microwave applications. These laminates offer a dielectric constant of 2.94 ± 0.05 and a low dissipation factor of 0.0021 at 10GHz, making them suitable for high-frequency designs. The materials also exhibit excellent dimensional stability and low PIM, ensuring consistent performance under varying environmental conditions.
| Property | Value |
| Dielectric Constant (Dk) | 2.94 at 10GHz |
| Dissipation Factor (Df) | 0.0021 at 10GHz |
| Thermal Conductivity | 0.4 W/mK |
| CTE (X/Y/Z) | 24ppm/°C, 23ppm/°C, 98ppm/°C |
| Operating Temperature | -55°C to +288°C |
| Thermal Coefficient of Dk | -73ppm/°C |
| Flammability | UL 94 V-0 |
Key Features:
- Dielectric Constant (Dk): 2.94 at 10GHz for precise signal control.
- Low Dissipation Factor (Df): 0.0021 at 10GHz for minimal signal loss.
- Thermal Stability: High operating temperature range and excellent thermal conductivity.
- Dimensional Stability: Low CTE (X/Y/Z) for reliable performance in extreme environments.
- Nickel-Free EPIG Finish: Ensures excellent signal integrity and eliminates issues with nickel magnetism.
Key Benefits:
- Low Loss Tangent: Ensures efficient performance in wireless frequency bands.
- Controlled Dielectric Constant: Provides repeatable circuit behavior.
- Low PIM (-159 dBc): Reduces yield loss and improves antenna performance.
- Eco-Friendly Design: UL 94 V-0 flame retardant and RoHS compliant.
- Enhanced Durability: Excellent interlaminar bond strength and low moisture absorption.
Applications
Cellular infrastructure base station antennas
Telematics antenna systems
Commercial satellite radio antennas
Conclusion
The 40mil AD300D 2-Layer PCB with EPIG Finish is a reliable and high-performance solution for RF, microwave, and wireless communication systems. Its combination of AD300D laminates and nickel-free EPIG surface finish ensures low-loss performance, excellent dimensional stability, and superior signal integrity. With worldwide availability and compliance with IPC-Class-2 standards, this PCB is the perfect choice for engineers designing high-frequency circuits for telecommunications, automotive, and aerospace applications.
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