Shenzhen Bicheng Electronics Technology Co., Ltd
                                                                                                           
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23 Years
Since 2003
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Aluminum PCB Circuit Board 8oz Heavy Copper

Price Negotiable
Price: USD40~50
MOQ: 1
Delivery Time: 7-8 working days
Brand: Bicheng Enterprise Limited
Product Description

Product profile

 

 

1.1 General description

 

This is a type of heavy copper single sided aluminum PCB board at 1.2mm thick for

the application of high current and high temperature dissipation. The base laminate

is from ITEQ 9oz Copper. It's fabricated per IPC 6012 Class 2 using supplied Gerber

data. Each 20 panel boards are packed separately.

 

 

1.2 Features and benifits

 

A. Optimization combination of power circuit and control circuit,
B. Replace the fragile ceramic substrate and obtain a better mechanical durability,
C. Effective heat diffusion in the design of the circuit,
D. Reduce the operating temperature of the equipment,
E. Improve the power density and reliability of the device,
F. Prolong the service life of the product,
G. Whole fabrication process are totally controlled.
H. 100% tests inclusive of electrical test and AOI inspection.
I.  Thermal stress test, reliability test, insulation resistance test and ionic contamination

     test
J. RoHS materials
K. Focus on low to medium volume production
L. Small quantity order is accepted

 

 

1.3 Application

 

Downlight, Automatic safety control system, DC/AC converter, power amplifier

 

 

1.4 Parameter and data sheet

Number of Layers 1
Board Type Single Sided PCB
Board Thickness 1.20 mm +/-0.1
Board Material Aluminum PCB, MCPCB
Board Material Supplier ITEQ
Tg Value of Board Material 150℃
 
PTH Cu thickness N/A
Inner Iayer Cu thicknes N/A
Surface Cu thickness 280 um (8 oz)
 
Solder Mask Type and Model No. N/A
Solder Mask Supplier N/A
Solder Mask Colour N/A
Number of Solder Masks N/A
Thickness of Solder Mask N/A
 
Type of Silkscreen Ink N/A
Supplier of Silkscreen N/A
Color of Silkscreen N/A
Number of Silkscreen N/A
 
Mininum Trace (mil) 16 mil
Minimum Gap(mil) 14.7 mil
 
Surface Finish OSP
RoHS Required Yes
Warpage 0.14%
 
Thermal Shock Test

Pass, 288±5℃,10 seconds, 3 cycles.

No delamination, no blistering.

Solderablity Test Pass, 255±5℃,5 seconds Wetting Area Least 95%
Function 100% Pass electrical test
Workmanship Compliance with IPC-A-600H & IPC-6012C Class 2

 

 

1.5 Outline dimension Unit: mm

NO. Required Dimension (toerance) Actual dimension
1 81.00 ±0.15 81.99 81.01 81.00 81.01
2 65.00 ±0.15 65.02 65.01 65.00 64.99

 

 

 

Pattern plating

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Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Shenzhen Bicheng Electronics Technology Co., Ltd
Location 6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China
Contact Person Sally Mao

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