Hello Guys,

The mixed high frequency PCB introduced today is 4-layer board on Rogers core of 20mil RO4003C pressed with FR-4.

Firstly, it's a 4 layer structure. Layer 1 to layer 2 is 20mil Rogers core, which are the main wiring layers for the signal lines.

Layer 3 to layer 4 is the FR-4 core, which is connected by the Prepreg of FR-4.

Each layer is connected by plated through holes. This is a better method to keep the board cost effective.

The inner layer and out layer of copper is 1 ounce.

Let's take a look at its microsection chart.

Here on the left is the PTH hole, the bottom is layer 1 to layer 2 which is high frequency material, the upper part is glass fiber material. The finished thickness of the plate is 1.6mm.

The color of solder mask and silkscreen are also commonly used in green and white. Surface finish on pads is immersion gold.

At present, the mature mixed pressing materials are as follows:

RO4350B + FR4;

RO4003C + FR4;

F4B + FR4;

RT/duroid5880 + FR4

RT/duroid5880 + RO4350B

We can provide you with prototype and mass production.

If you're interested in hybrid PCB, please feel free to contact us.

Thank you for your reading.