Shenzhen Bicheng Electronics Technology Co., Ltd
                                                                                                           
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10 Layer High Frequency PCB Built On 5 Cores of 10mil RO4350B with 4mil RO4450F for Broadband Wireless Solutions

Price Negotiable
Price: USD 2.99-5.99 per piece
MOQ: 1
Delivery Time: 6-7 working days
Brand: Bicheng Technologies Limited
Product Description

10 Layer High Frequency PCB Built On 5 Cores of 10mil RO4350B with 4mil RO4450F for Broadband Wireless Solutions
(PCB's are custom-made products, the picture and parameters shown are just for reference)
 
Hello everyone,
Good day!
In the previous products, we’ve talked 4-layer RF PCB and 6-layer RF PCB. We have known that Rogers multilayer PCBs are made of every different core. So 10-layer RF PCB becomes simple now, is it right?
 
10-layer RF PCB is made on 5 cores of Rogers material. Since the final thickness will not be much thicker, so the thin core is usually used, such as 6.6mil RO4350B, 10mil RO4350B, 13.3mil RO4350B, 8mil RO4003C and12mil RO4003C etc.
 
Today this 10-layer PCB is on 5 cores of 10mil RO4350B combined by RO4450F prepreg.
It’s for the application of broadband wireless solutions. It's 2.0 mm thick, pads are immersion gold plated. It's fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 10 boards are packed for shipment.
 
Features and benefits
1) Excellent dimensional stability.
2) Good high temperature and low temperature resistance.(-192℃-260℃)
3) Immersion gold has excellent surface planarity, particularly helpful for PCBs with BGA packages or even CSP mounted components to reduce failure rate during assembly and soldering.
4) Engineering design prevents problems from occurring in preproduction.
5) DDU Door to door shipment with competitive shipping cost,
6) No MOQ, low cost for prototypes and samples.
 
Applications
RF transceiver, Communications relays, Low Noise Block, Splitter module
 
Parameter and data sheet

PCB SIZE115 x 110mm=1PCS=1design
BOARD TYPEHigh Frequency PCB, Multilayer PCB
Number of Layers10 layers
Surface Mount ComponentsYES
Through Hole ComponentsNO
LAYER STACKUPTOP Layer: signal - 1/2oz foil + 25μm Cu
Core RO4350B -0.254mm
INT 1: mixed - 1/2oz foil
Prepreg RO4450F -0.202mm (2 x 0.101)
INT 2: mixed - 1/2oz foil
Core RO4350B -0.254mm
INT 3: mixed - 1/2oz foil
Prepreg RO4450F -0.202mm (2 x 0.101)
INT 4: mixed - 1/2oz foil
Core RO4350B -0.254mm
INT 5: mixed - 1/2oz foil
Prepreg RO4450F -0.202mm (2 x 0.101)
INT 6: mixed - 1/2oz foil
Core RO4350B -0.254mm
INT 7: mixed - 1/2oz foil
Prepreg RO4450F -0.202mm (2 x 0.101)
INT 8: mixed - 1/2oz foil
Core RO4350B -0.254mm
BOT Layer: signal - 1/2oz foil + 25μm Cu
TECHNOLOGY 
Minimum Trace and Space:5.5mil/5mil
Minimum / Maximum Holes:0.3/2.0mm
Number of Different Holes:9
Number of Drill Holes:7505
Number of Milled Slots:0
Number of Internal Cutouts:0
Impedance ControlNO
BOARD MATERIAL 
Glass Epoxy:RO4350B core 0.254mm(10mil), RO4450B PP 0.1mm(4mil)
Final foil external:1oz
Final foil internal:0.5oz
Final height of PCB:2.0mm ±10%
PLATING AND COATING 
Surface FinishElectroless nickel over Immersion Gold (ENIG)( 0.05µm over 3µm nickel)
Solder Mask Apply To:N/A
Solder Mask Color:N/A
Solder Mask Type:N/A
CONTOUR/CUTTINGRouting
MARKING 
Side of Component LegendN/A
Colour of Component LegendN/A
Manufacturer Name or Logo:N/A
VIAPlated Through Hole(PTH), via tented. BGA package
FLAMIBILITY RATINGUL 94-V0 Approval MIN.
DIMENSION TOLERANCE 
Outline dimension:0.0059" (0.15mm)
Board plating:0.0030" (0.076mm)
Drill tolerance:0.002" (0.05mm)
TEST100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIEDemail file, Gerber RS-274-X, PCBDOC etc
SERVICE AREAWorldwide, Globally.
 

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Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Shenzhen Bicheng Electronics Technology Co., Ltd
Location 6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China
Contact Person Sally Mao

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