Substrate Material

Taconic RF-35 substrate is a member of the Taconic ORCER family and is constructed with a PTFE ceramic woven glass composite material. The tightly-controlled weave of glass reinforcement threads stabilizes mechanical properties while the PTFE matrix maintains an exceptionally smooth surface ideal for high frequency use.

With a dielectric constant of just 3.5 and minuscule dissipation factor of 0.0018 measured precisely at 1.9GHz, RF-35 exhibits outstanding electrical performance in this key frequency band where losses really matter. Its breakdown voltage of 41kV also far exceeds the voltage handling needed in most PCB-based radio applications.

• Dielectric Constant at 1.9GHz: 3.5, maintaining optimal signal integrity.
• Dissipation Factor at 1.9GHz: 0.0018, minimizing signal loss and distortion.
• Dielectric Breakdown: 41 kV, ensuring safety and reliability.
• Coefficient of Thermal Expansion (CTE): x-y CTE 19 ppm/°C, 24 ppm/°C, z CTE 64 ppm/°C, providing dimensional stability under varying temperature conditions.

Board Construction

A simple yet effective 2-layer stacked design layers 35um copper on each side of a 20mil thick RF-35 core. Meticulously rolled to a finished board thickness of 0.6mm, this uniform stackup enables reliable impedance control for transmission lines running at GHz speeds.

Capability for 6/4mil trace/space parameters and 0.3mm micro-vias allows dense packing components and circuitry into each unique 115x59mm board footprint. With 25 surface mount and plated through-hole positions available and a total pad count of 168, complex network designs can be realized.

Functions:

The 2-Layer PCB serves as a key component in electronic circuits, providing essential functions such as:

• Signal Transmission: Efficiently transfers signals between different components, ensuring seamless communication within the circuit.
• Power Distribution: Distributes power evenly throughout the circuit, delivering the required voltage and current to various components.
• Mechanical Support: Acts as a sturdy foundation, providing mechanical support and protection against external stresses and vibrations.
• Component Mounting: Offers a secure platform for mounting and soldering electronic components, ensuring proper alignment and connection.

Advantages:

• Excellent signal integrity up to 2GHz from low-Dk, low loss RF-35 substrate
• Enabled GHz circuit densities with 6/4 mil trace/spacing rule
• Global supply chain simplifies large-scale procurement
• IPC Class 2 workmanship ensures quality and reliability
• Cost-effective for volume production runs

Disadvantages:

• Limited to basic 2-layer design complexity
• Fixed board size of 115x59mm may not accommodate all components
• Not suitable for systems requiring embedded passives or interlayer connectivity
• Higher cost than mainstream FR-4 PCBs for non-RF applications
• Substrate material availability could impact lead times versus standard laminates

Applications:

• Power Amplifiers: Provides a reliable platform for power amplifier circuits, ensuring efficient amplification of signals.
• Filters and Couplers: Enables the implementation of filters and couplers for signal conditioning and frequency manipulation.
• Passive Components: Supports the integration of passive components such as resistors, capacitors, and inductors.

Contact Information:
For any technical inquiries or further information, please contact Sally Mao at sales@bichengpcb.com.