engineered reliability with Rogers RO3006 PCB

When designing circuits requiring uncompromising thermal stability, Roger's RO3006 ceramic-filled PTFE composites set the industry standard.

Precise Formulation

A proprietary blend of high-purity PTFE resin and ceramic microparticles yields RO3006's homogeneous structure. This consistency results in its hallmark Dk stability from -55°C to over 200°C. Even minute shifts in the material properties can cause design issues, so RO3006's uniformity across broad temperatures is invaluable for mission-critical applications.

Optimal Mechanical Match
RO3006's incredibly low 17ppm/°C CTE perfectly mirrors standard copper foil, eliminating delamination concerns. Thermal cycling stresses are minimized, preserving electrical performance through thousands of temperature fluctuations. Ruggedness paired with RO3006's 0.79W/mK thermal conductivity also prevents component overheating under high power loads.

Consistent Process Controls
All RO3006 materials are fabricated through Rogers' proprietary fabrication process in an ISO 9001 certified facility. Tight manufacturing specifications ensure lot-to-lot uniformity customers can rely on. Post-lamination testing validates key parameters like Dk, Df and CTE fall precisely within published spec limits.

Availability and Support
Standard RO3006 laminate and prepreg materials are stocked in 50mil, 1oz copper and 62mil/1oz copper configurations respectively for quick turn prototyping. Experienced design engineers can also assist with custom configurations for specialized high-frequency or voltage requirements.

When demanding applications call for uncompromising stability, trust Rogers RO3006 to deliver fully-reliable designs generation after generation.