Engineering Thermal Excellence for Demanding RF Applications

Rogers RT/duroid 6035HTC was developed through extensive material formulation to handle the punishing thermal requirements of kW-level RF circuits. Crafted from a proprietary ceramic-filled PTFE composite, it achieves class-leading thermal dissipation without compromising electrical performance.

This starts from the laminate core, which maintains a precisely calibrated Dk of 3.5 ±0.05 across frequencies to 10GHz. Its dissipation factor of just 0.0013 further ensures transmission lines exhibit minimal losses.

Where 6035HTC really shines is its thermal properties. With a thermal conductivity of 1.44 W/mK, it outperforms even some of the highest performing aluminum oxide-filled laminates on the market. This allows circuits to continuously dissipate enormous power loadings without risk of damage.

Dimensionally, 6035HTC maintains tight 19ppm CTE values from -55°C to 260°C. This dimensional stability prevents warping even as assemblies undergo rapid thermal cycling.

Our ISO 9001 plant produces 6035HTC-based boards to IPC Class 3 workmanship using a controlled drilling process tailored to its composition. Standard board sizes are available or can be custom cut up to 3m x 1.5m.

Power amplifier, phased array and radar designers have come to rely on 6035HTC's unparalleled ability to move heat away from active devices. Contact us to discuss how its meticulously engineered properties can boost the reliability of your most demanding RF applications.