We're thrilled to unveil our groundbreaking new radio frequency (RF) printed circuit board (PCB) material - an innovation that's poised to disrupt high frequency electronics. Engineers, get ready to be wowed!

This radically new PCB substrate will supercharge your RF systems. How, you ask? For starters, its low-loss wonder material boasts a dielectric constant of just 3.5 and a miniscule dissipation factor of 0.0018 at 1.9 GHz. Translation? Extremely efficient performance for all your high frequency needs.

But it gets better. This ultra slick material delivers smooth signal transmission up to 6 GHz with a breakdown voltage of 41 kV. Yeah, you read that right - 41 kV! Plus, its expansion is precisely dialed in along the x, y, and z axes. Say goodbye to thermal variation ruining your perfectly planned out board layouts.

This innovative PCB material provides:

• Ultra low loss - with a dielectric constant of 3.5 and dissipation factor of 0.0018 at 1.9 GHz
• High breakdown voltage - 41 kV dielectric breakdown strength
• Controlled thermal expansion - CTE of 19 ppm/°C in x-axis

We use the Taconic ORCER material in a 2-layer, 60 mil thick stackup. The board construction includes:

• 2 oz copper layers
• Minimum 5/6 mil trace/space
• 25 μm plated through hole vias
• Immersion tin finishing

Key benefits this PCB material delivers:

• Enhance the performance of RF components like power amplifiers, filters and couplers
• Provide excellent moisture resistance
• Enable precise control of thermal expansion

RF engineers interested in learning more about this groundbreaking material's capabilities and leveraging it for their next project should contact Sally Mao at sales30@bichengpcb.com. The potential to push high frequency electronics to new heights awaits.