New 2-Layer High Frequency PCB Released Using Rogers RT/duroid 6035HTC Material

A new 2-layer rigid printed circuit board has been released by our engineering team made with Rogers RT/duroid 6035HTC ceramic filled PTFE composite as the core substrate material. Optimization for high frequency applications up to 10GHz has been a key design goal with this PCB.

The stackup implemented consists of a 0.508mm thick layer of the Rogers RT/duroid 6035HTC material laminated between 1oz copper layers on the top and bottom. This dielectric material has been chosen specifically for its electrical properties that include a low dissipation factor of 0.0013 and excellent thermal stability across an operating range of -50°C to 150°C.

Complex layouts and routing have been made possible through the use of minimum 5/5 mil trace/space patterns, 0.35mm holes for component leads, and 100 microvias distributed through the design. An immersion silver plating has been selected as the surface finish to provide maximum solderability and process yield.

The first panel produced measures 89.24mm x 11.8mm and contains placement for 128 components with 112 pads interconnected through just 6 nets. A high level of integration and design optimization has been facilitated by the properties of the circuit material and fabrication process. Manufacturing of the PCB has been completed following IPC Class 2 requirements to ensure a quality product.

Extensive testing has been performed by our engineers to verify performance across operating frequencies up to 10GHz and temperatures from -40°C to +85°C. S-parameter results demonstrate excellent signal transmission and low loss through these high frequency boards. They are well-suited for telecom infrastructure applications, radar and satellite systems, aerospace and defense electronics, and other demanding environments needing stable electrical performance.

Our experienced engineering team can provide further guidance on how this PCB can be customized for your specific design requirements. Additional layers, different dielectric thicknesses, supplemental coatings or finishes, and other options can be evaluated as needed for your application. We welcome the opportunity to support prototyping of your next generation radio frequency circuit board. Please contact us for any technical questions or quotation requests.