Shenzhen Bicheng Electronics Technology Co., Ltd
                                                                                                           
Verified Supplier
23 Years
Since 2003
Menu
Machinery Electronics Production Machinery

20mil 2-layer rigid RO4360G2 PCB 35um copper thickness 0.6mm Immersion Silver for automotive, aerospace

Price Negotiable
Price: USD78~110
MOQ: 1
Delivery Time: 2-3 working days
Brand: Bicheng Enterprise Limited
Product Description

A new two-layer rigid printed circuit board (PCB) designed for operation in demanding temperature environments has recently been shipped by Bicheng Electronics. The 43mm x 86mm board was constructed using hydrocarbon ceramic woven glass laminate material RO4360G2, which allows operation from -40°C to +85°C, making it suitable for automotive, aerospace, and industrial applications.

 

 

The PCB stackup consists of two 1oz copper layers, between which 20 mil of RO4360G2 dielectric material was used, resulting in a finished board thickness of 0.6mm. The lead-free fabrication process was executed to meet IPC Class 2 requirements with minimum 7/9 mil trace/space, 0.3mm minimum hole size, and 1 mil via plating.

 

There are a total of 35 components on the PCB, with 90 pads, including 26 thru-hole and 64 surface mount pads on the top layer. No components were placed on the bottom layer. The board routing contains 12 nets connecting the 46 vias between layers. Electrical testing was done to ensure 100% properly functioning boards prior to shipping.

 

Specification Value
Board Dimensions 43mm x 86 mm +/- 0.15mm
Minimum Trace/Space 7/9 mils
Minimum Hole Size 0.3mm
Blind/Buried Vias None
Finished Board Thickness 0.6mm
Finished Cu Weight 1 oz (1.4 mils) all layers
Via Plating Thickness 1 mil
Surface Finish Immersion Silver
Top Silkscreen No
Bottom Silkscreen No
Top Solder Mask No
Bottom Solder Mask No

 

The PCB layers were laid out using Gerber RS-274X format artwork for precise reproduction during fabrication. Reflow soldering will allow efficient component attachment. Selective gold plating may be applied to contact fingers or areas needing solderability protection.

 

Several features make the board well-suited for rugged applications. The RO4360G2 base material provides a Tg of >280°C for resisting high temperatures. The 1oz copper provides excellent thermal performance to dissipate heat. The woven glass reinforcement increases strength and ruggedness. Immersion silver finish was used to allow extended shelf life and excellent solderability.

 

Bicheng Electronics maintains capabilities for quick-turn prototyping in addition to medium and high volume PCB production. Their comprehensive quality system and rigorous testing ensures consistent products that meet requirements. Customers receive regular communication and support throughout the fabrication process. Any technical questions should be directed to Sally Mao at sales30@bichengpcb.com.

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Shenzhen Bicheng Electronics Technology Co., Ltd
Location 6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China
Contact Person Sally Mao

Request A Quote

Please check your email address.
Your message must be at least 20 characters.