A newly shipped printed circuit board has been constructed using RT/duroid 6035HTC PTFE ceramic material, enabling operation from -40°C to +85°C. The lead-free manufacturing process eliminates the use of harmful lead.

The board measures 132 by 101 millimeters with a thickness of 0.6 millimeters. Minimum trace and spacing widths have been set at 9 mils while the smallest hole size attainable is 0.3 millimeters. No blind or buried vias were created during construction.

The copper weight of 1.5 ounces has been distributed across two layers with a thickness of 35 micrometers for the finished copper. Vias have been plated to a thickness of 1 mil and the surface has been finished using immersion silver. Neither top nor bottom silkscreens nor solder masks were applied. Solder pads remain free of silkscreen.

The board statistics reveal 35 components, 90 total pads comprising 26 through-hole pads and 64 surface mount pads on the top side. A total of 46 vias and 12 nets were implemented.

The supplied artwork format is Gerber RS-274-X.

With its advanced construction and specifications, the newly shipped PCB provides a reliable and high-performance platform for electronic assemblies. The utilization of RT/duroid 6035HTC PTFE Ceramic as the PCB material, along with the implementation of a lead-free manufacturing process, ensures optimal electrical properties and environmental compliance. The precise board dimensions, small minimum hole size, and extensive electrical testing further contribute to the PCB's reliability. As a result, this PCB is well-suited for a range of applications that demand exceptional performance and durability.

For any technical inquiries or further information, please contact Sally Mao at sales30@bichengpcb.com.