Specifications for a 2-Layer Rigid PCB Design

The key specifications for a recently designed 2-layer rigid PCB were documented in order to share the considerations that go into PCB design. The details below cover the materials, stackup, construction details, statistics, artwork format, quality standards, and contact information.

The PCB material chosen was RO4003C hydrocarbon ceramic laminates, which provide thermal stability across a wide temperature range of -40°C to +85°C. The laminates were selected to be lead-free for environmental compliance.

A 2-layer stackup was constructed with finished copper of 35um used on each signal layer. The core dielectric selected was RO4003C with a thickness of 32mil (0.8mm). This resulted in a total finished board thickness of 0.9mm.

The board dimensions were specified at 139mm x 100mm (6 pieces) with a tolerance of +/- 0.15mm allowed. A minimum trace/space of 4/4 mils was specified to allow for tighter routing. A minimum hole size of 0.5mm was set. No blind or buried vias were used to reduce cost. The finished copper weight was chosen to be 1 oz (1.4 mil) on all layers. 1 mil via plating was used to connect the layers. ENIG surface finish was selected for solderability and shelf life. No soldermask or silkscreen were used for cost savings. 100% electrical testing was specified for quality assurance. 0.5mm filled vias were implemented per IPC-4761 Type VII.

The PCB statistics show 97 components, with 130 total pads, 49 thru-hole pads, 81 SMT pads, 151 vias, and 17 nets for routing.

Gerber RS-274X artwork format was supplied for manufacturing. IPC-Class-2 quality standard was targeted for high reliability commercial product requirements.

Any technical questions can be directed to Sally Mao at sales30@bichengpcb.com who can be contacted as needed.

Please let me know if you would like any part of this revised in a more passive tone or expression. I'm happy to make additional changes.