Guotai DC Magnetron Sputtering Machine With Customized Features DISC-SP-3200

1. Application direction: research and teaching

2. Product advantages: Inclined co-sputtering, single chip sending to the sampling chamber (Load-Lock)

3. Product configuration:

★ Sample quantity and size: 1 piece Ф2 inch ~ Ф6 inch

★ Sputtering materials: metal; non-metal; compound and other thin film materials.

★ Sputtering chamber: high vacuum system.

★ Load-Lock: Low vacuum system or high vacuum system. Single-piece, samples are automatically transported.

★ Sputtering unevenness: ≤±3%-±5%

★ Magnetron target: 2-4 pcs; adjustable angle

★ Sputtering direction: sample bottom (sputtering from top to bottom) or sample top (sputtering from bottom to top)

★ Heating: conventional heating, optional high temperature heating

★ Power supply configuration: RF; DC; DC pulse; DC bias

★ Cleaning function: optional Kaufman ion source

★ Fast reaction sputtering function: optional Speedflo

★ Film thickness monitoring function: optional crystal control film thickness online monitoring and end point control

★ Operation mode: automatic + semi-automatic control

For the detailed structure and function of the equipment, please consult the sales engineer.