RF Magnetron Sputtering System Quarts Crystal Optic Coating Machine

Magnetron sputter deposition does not require melting and evaporation of the source material, leading to many advantages over other PVD technologies: first, nearly all materials can be deposited by magnetron sputtering regardless of their melting temperature; second, sources can be scaled and positioned anywhere in the chamber based on the requirements of the substrate and the coating; finally, films of alloys and compounds can be deposited while maintaining similar composition to that of the source material. Successful magnetron sputter deposition requires the correct choice of power delivery system. To learn more, explore DC magnetron sputtering, RF magnetron sputtering, and pulsed DC sputtering.

1. Application direction: research and teaching

2. Product advantages: Inclined co-sputtering, single-chip delivery sample room, separate metal coating room and non-metal coating room

3. Product configuration:

★ Sample quantity and size: 1 piece of Ф4 inches or more~Ф10 inches

★ Sputtering material: metal and non-metal.

★ Sputtering chamber: Both coating chambers are high vacuum systems.

★ Sputtering unevenness: ≤±3%-±5%

★ Magnetron target: 2-4 pieces per coating room; adjustable angle; adjustable distance

★ Sputtering direction: sample bottom (sputtering from top to bottom) or sample top (sputtering from bottom to top)

★ Heating: conventional heating, optional high temperature heating

★ Power supply configuration: RF; DC; DC pulse; DC bias

★ Cleaning function: optional Kaufman ion source

★ Fast reaction sputtering function: optional Speedflo

★ Film thickness monitoring function: optional crystal control film thickness online monitoring and end point control

★ Operation mode: automatic + semi-automatic control

Similar products: Single cavity sputtering chamber + single chip sampling chamber (MSP-3200)

For the detailed structure and function of the equipment, please consult the sales engineer.