HN21126 JEDEC Matrix Tray 322.6x135.9mm with 135 Pockets for BGA IC Components
Price:
$1.35~$2.38(Prices are determined according to different incoterms and quantities）
MOQ:
1000 pcs
Delivery Time:
5~8 working days
Brand:
Hiner-pack
Product Description
Product Overview
Our JEDEC matrix trays are manufactured in strict compliance with industry standards, featuring a rectangular profile with evenly spaced pockets. The standardized dimensions of 322.6mm × 135.89mm ensure easy stacking for storage and manufacturing processes, reducing manual handling while enabling complete automation services.
HN21126 JEDEC Tray Specifications
| Outline Size | 322.6 × 135.9 × 10mm | Brand | Hiner-pack |
|---|---|---|---|
| Model | HN21126 | Package Type | BGA |
| Cavity Size | 14.31 × 8.31 × 6mm | Matrix Quantity | 15 × 9 = 135 PCS |
| Material | MPPO | Flatness | MAX 0.76mm |
| Color | Black | Origin | China |
| Resistance | 1.0×10⁴-1.0×10¹¹Ω | Certification | ROHS SGS |
Material Properties
| Material | Bake Temperature | Surface Resistance |
|---|---|---|
| PPE | 125°C - Max 150°C | 1.0×10⁴Ω - 1.0×10¹¹Ω |
| MPPO + Carbon Fiber | 125°C - Max 150°C | 1.0×10⁴Ω - 1.0×10¹¹Ω |
| MPPO + Carbon Powder | 125°C - Max 150°C | 1.0×10⁴Ω - 1.0×10¹¹Ω |
| MPPO + Glass Fiber | 125°C - Max 150°C | 1.0×10⁴Ω - 1.0×10¹¹Ω |
| PEI + Carbon Fiber | Max 180°C | 1.0×10⁴Ω - 1.0×10¹¹Ω |
| IDP Color | 85°C | 1.0×10⁶Ω - 1.0×10¹⁰Ω |
Custom color, temperature, and other special requirements available upon request.
Applications
- Electronic Components
- Optical Electronic Components
- Embedded Systems
- Micro and Nano Systems
Manufacturing Services
- Sample stock available with expert product selection guidance
- 24/7 customer support and technical assistance
- Customized solutions tailored to specific requirements
- Comprehensive service from consultation to after-sales support
- 10+ years OEM experience for USA and EU markets
- In-house factory ensuring high quality control and flexible production
Frequently Asked Questions
Q1: Are you a manufacturer or trading company?
We are a 100% manufacturer with over 10 years of packaging expertise, operating from a 1500 square meter workshop in Shenzhen, China.
Q2: What materials do you use?
We work with various materials including ABS, PC, PPE, MPPO, PEI, HIPS, and more.
Q3: Can you assist with design customization?
Yes, we provide complete customization services and can design packaging according to your specific requirements.
Q4: How do I get a custom product quotation?
Provide your IC size or component thickness, and we will prepare a detailed quotation.
Q5: Can I receive samples before placing a bulk order?
Yes, we offer sample products from stock, though shipping costs are the customer's responsibility.
Q6: Can you add my logo to the product?
Yes, we can incorporate your logo. Please provide your logo design for implementation.
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Shenzhen Hiner Technology Co., Ltd.
Location
Building A11, Zone D, West Industrial Zone, Minzhu Community, Shajing Street, Baoan District, Shenzhen City, GD Province CN
Contact Person
Zhu