ESD Factory Circuits  QFP QFN  Plastic Molded Electronic Parts Packaging Tray

Built to global JEDEC standards, our trays offer repeatable performance, high dimensional accuracy, and long-term reliability.

Designed to meet the rigorous demands of modern semiconductor and electronics manufacturing, the JEDEC matrix tray delivers dependable performance in automated and manual environments. Made from high-performance, ESD-safe material, it ensures component protection from electrostatic discharge and physical damage. Precision-molded pockets securely hold each unit in place, while integrated alignment features simplify setup on conveyors, feeders, and robotic systems. With its robust structure and compatibility across JEDEC-standard processes, this tray helps manufacturers reduce error rates and improve process consistency across the board.

Features & Benefits:

•  JEDEC-Compliant Design: Universally compatible with JEDEC-standard handling systems, reducing integration costs and setup time.  

•  ESD-Resistant Material: Built with conductive polymers that dissipate electrostatic charges to protect sensitive components.  

•  Secure Component Seating: Molded cells prevent device shifting during transit, handling, or pick-and-place operations.  

•  Optimized for Automation: Chamfered corners, flat pocket bottoms, and pick-up recesses enable seamless use with vacuum tools and automated handling.  

•  Rugged & Reusable: Designed to withstand high-throughput usage cycles in industrial environments without deformation or cracking.  

•  Stackable with Stability: Stacking features align trays precisely and prevent sliding, supporting safe and space-efficient vertical storage

Technical Parameters:

Application:

This tray is well-suited for processes including device testing, SMT component placement, IC packaging, and logistics. Its structural rigidity and dimensional consistency make it ideal for systems requiring tight tolerances, including robotic pick-and-place arms and vacuum feeders. It is used widely in industries such as microelectronics, photonics, communications, and automotive electronics, where part protection and process uniformity are essential. 

Customization:

Various customization options are available to support specialized workflows and proprietary component shapes: 

•  Pocket Layout Adjustments: Customize pocket depth, width, and geometry to fit unique package types or irregular device forms.  

•  Color Variations: Use distinct ESD-safe color materials for part categorization, production tracking, or process segregation.  

•  Molded Identifiers: Integrate permanent raised codes, customer-specific marks, or internal tracking indicators into the tray during manufacturing.  

•  Feature Modifications: Add mechanical locating features, altered support structures, or specialized vacuum access points to suit unique automation or transport setups.