Shenzhen Hiner Technology Co., Ltd.
                                                                                                           
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13 Years
Since 2013
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Packaging & Printing Logistics Packaging Protective & Cushioning Material

MPPO Snap On BGA JEDEC Matrix Trays Stackable With Secure Lid Protection

Price Negotiable
Price: $1.35~$2.38(Prices are determined according to different incoterms and quantities)
MOQ: 1000 pcs
Delivery Time: 1~2 Weeks
Brand: Hiner-pack
Product Description

MPPO Snap On BGA JEDEC Matrix Trays Stackable With Secure Lid Protection


Designed with your product in mind, our JEDEC trays support tight tolerances and automated handling systems.


The trays are made from MPPO material, which provides excellent durability and resistance to impact and stress. The temperature range of the JEDEC Matrix Trays is also impressive, with a range of 0°C to +180°C. This makes them suitable for use in a wide range of environments and applications, including in the manufacturing of electronic components and devices.


For those in the electronics industry, the JEDEC Matrix Trays are an ideal choice for safely storing and transporting delicate components. Additionally, the JEDEC Matrix Trays are anti-static, providing a further layer of protection against damage from static electricity. This makes them an ideal choice for use in environments where static electricity may be a concern, such as in clean rooms or other sensitive manufacturing environments.


Technical Parameters:


Brand Hiner-pack Outline Line Size 322.6*135.9*7.62mm
Model HN23044 Cavity Size  8.2*7.2*1.38 mm
Package Type IC Component Matrix QTY 11*5=55PCS
Material MPPO Flatness MAX 0.76mm
Color Black Service Accept OEM, ODM
Resistance 1.0x10e4-1.0x10e11Ω Certificate RoHS

JEDEC tray ic chip tray HN23044-1

Applications:


Ideal for semiconductor packaging, testing, and automated board assembly operations, this tray excels where component integrity and process efficiency are priorities. It supports robotic pick-and-place activities and integrates into handling systems without the need for modification. The tray is also suitable for environments requiring frequent movement between stations—such as SMT lines, cleanrooms, or IC programming labs—where consistent component orientation and secure seating are essential.
JEDEC tray ic chip tray HN23044-2

Customization:


Adapt the tray’s internal layout and appearance to meet unique manufacturing or part-specific needs:
•  Customized Pocket Geometry: Modify cell shapes, wall heights, or part-retention details to accommodate varied device profiles.  
•  Color Selection: Choose ESD-safe colors to differentiate production batches, product types, or workflow stages.  
•  Integrated Molded Identification: Add part numbers, process codes, or customer logos as permanent molded features for easy traceability.

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Shenzhen Hiner Technology Co., Ltd.
Location Building A11, Zone D, West Industrial Zone, Minzhu Community, Shajing Street, Baoan District, Shenzhen City, GD Province CN
Contact Person Zhu

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