Shenzhen Hiner Technology Co., Ltd.
                                                                                                           
Verified Supplier
13 Years
Since 2013
Menu

Anti-Static Reusable Waffle Pack Chip Trays with Customizable Cavity Size for Semiconductor ICs

Price Negotiable
Price: $1.35~$2.68(Prices Are Determined According To Different Incoterms And Quantities)
MOQ: 500 pcs
Delivery Time: 10 workdays
Brand: Hiner-pack
Product Description
ESD Anti Static Semiconductor Waffle Chip Trays

Deliver precise waffle structure to cradle delicate IC chips tightly, eliminating movement and electrostatic damage during handling. Crafted from durable anti-static material to maintain consistent performance in industrial environments, offering reliable protection for sensitive semiconductor components.


Integrate seamlessly with automated packaging lines and cleanroom workflows, performing steadily in chip loading, transfer, and inventory management procedures. Adapt flexibly to diverse semiconductor manufacturing scenarios, supporting efficient production and logistics operations.


Support full customization of cavity size, spacing, and layout to match unique chip dimensions. Align with clean production standards, delivering tailored solutions that optimize packaging efficiency and safeguard IC chips throughout transit and storage.

Key Features/ Benefits 
  • Deliver effective ESD anti-static performance
  • Anti-static protection
  • Suitable for Delicate Fine Pitch ICs
  • Secure chip holding
  • Support fully customized cavity sizes and layout designs
  • The factory has ISO certification, and the products comply with the RoHS standard.
Specifications
Brand Hiner-pack
Model HN24190
Color Black
Resistance 1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size 50.8×50.8×4 mm
Cavity Size 2.2x1.35x0.53 mm
Matrix QTY 10x9=90 PCS
Warpage MAX 0.23mm
Service Accept OEM, ODM
Custom Pocket Options Available
Applications
Support semiconductor wafer dicing, die sorting, device testing, and precision component kitting operations. Work seamlessly with automated pick-and-place systems, ESD-controlled production lines, and clean manufacturing environments


Also applied in inter-plant component transfer, international shipping of sensitive chips, and long-term inventory storage. Serve semiconductor fabs, IC packaging facilities, and global electronic component distributors.

Packaging & Shipping/ Services
Provide fully customized solutions for anti-static waffle pack trays. Adjust cavity size, spacing, and layout to fit diverse chip dimensions.

Leverage durable anti-static material for enhanced protection. Offer prototype testing and personalized design support to meet unique production and packaging needs.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

  • Rich experience in JEDEC / IC / Waffle pack trays
  • In-house mold design capability
  • Fast prototype development
  • Strict QC process
  • Stable supply for global semiconductor customers

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Shenzhen Hiner Technology Co., Ltd.
Location Building A11, Zone D, West Industrial Zone, Minzhu Community, Shajing Street, Baoan District, Shenzhen City, GD Province CN
Contact Person Zhu

Request A Quote

Please check your email address.
Your message must be at least 20 characters.