High Temp ESD Waffle Trays for Semiconductor ICs
Price:
$1.35~$2.68(Prices Are Determined According To Different Incoterms And Quantities）
MOQ:
500 pcs
Delivery Time:
10 workdays
Brand:
Hiner-pack
Product Description
High Temp ESD Waffle Trays for Semiconductor ICs
Adopts high temperature resistant material and anti-static structure to provide stable performance in harsh production conditions. Effectively fixes semiconductor IC chips and avoids displacement or damage during high temp processing.
Works well in high temperature processing procedures and automatic production lines. Ensures stable placement of chips and maintains component integrity in continuous operation.
Supports customization of cavity size and arrangement to fit different IC specifications. Focuses on safe fixing and reliable protection to meet various semiconductor production requirements.
Key Features/ Benefits
- ESD protection
- High temperature resistance
- Suitable for Delicate Fine Pitch ICs
- Protects delicate fine pitch IC components efficiently
- Support fully customized cavity sizes and layout designs
- The factory has ISO certification, and the products comply with the RoHS standard.
Specifications
| Brand | Hiner-pack | ||
| Color | Black | ||
| Outline Line Size | 50.8×50.8×3.94 mm | ||
| Matrix QTY | 7x7=49 PCS | ||
| Service | Accept OEM, ODM | ||
Applications
Suitable for high temperature semiconductor processing, chip baking, component testing and packaging procedures. Fits well in automatic production lines and high temperature working environments.
Applied in chip production, semiconductor packaging, electronic component processing and factory internal transportation. Widely used in semiconductor factories and electronic manufacturing plants.
Packaging & Shipping/ Services
Packed in standard cartons with inner protective layers to avoid scratches and deformation. Stacked safely for bulk transportation.
Supports sea, air and international express shipping. Ensures products arrive in good condition and ready for direct use in production.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.
Why Choose Us:
- Rich experience in JEDEC / IC / waffle pack trays
- In-house mold design capability
- Fast prototype development
- Strict QC process
- Stable supply for global semiconductor customers
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Shenzhen Hiner Technology Co., Ltd.
Location
Building A11, Zone D, West Industrial Zone, Minzhu Community, Shajing Street, Baoan District, Shenzhen City, GD Province CN
Contact Person
Zhu