Durable Grid Waffle Trays for Safe Fine Pitch IC Handling
Price:
$1.35~$2.68(Prices Are Determined According To Different Incoterms And Quantities）
MOQ:
500 pcs
Delivery Time:
10 workdays
Brand:
Hiner-pack
Product Description
Durable Grid Waffle Trays for Safe Fine Pitch IC Handling
Feature uniform grid design to hold fine pitch ICs steadily without shifting. Fit various industrial processes and protect sensitive components from damage during daily operation.
Bring reliable performance for long-term use and reduce component loss in production and transfer. Match automatic equipment to improve working efficiency effectively.
Accept customized cavity size and layout to meet different chip requirements. Focus on practical protection to satisfy diverse production demands.
Key Features/ Benefits
- Secure component fixing
- Offers stable cleanroom-grade contamination control
- Stable component holding
- Protects delicate fine pitch IC components efficiently
- Support fully customized cavity sizes and layout designs
- Precise waffle structure.
Specifications
| Brand | Hiner-pack | ||
| Color | Black | ||
| Outline Line Size | 50.8×50.8×3.94 mm | ||
| Matrix QTY | 5x7=35 PCS | ||
| Service | Accept OEM, ODM | ||
Applications
Suitable for fine pitch IC storage, production line transfer, component testing and packaging. Work stably in automatic industrial systems and daily manufacturing processes.
Applied in semiconductor factories, electronic assembly plants and chip packaging workshops. Ideal for industrial production, internal transportation and long-term component storage.
Packaging & Shipping/ Services
Packed in standard cartons with protective inner layers to avoid scratches and deformation. Support safe stacking for bulk transportation.
Available for sea, air and international express shipping. Ensure products arrive in good condition and ready for immediate industrial use.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.
Why Choose Us:
- Rich experience in JEDEC / IC / waffle pack trays
- In-house mold design capability
- Fast prototype development
- Strict QC process
- Stable supply for global semiconductor customers
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Shenzhen Hiner Technology Co., Ltd.
Location
Building A11, Zone D, West Industrial Zone, Minzhu Community, Shajing Street, Baoan District, Shenzhen City, GD Province CN
Contact Person
Zhu