Durable Waffle Pack Chip Trays with Uniform Grid to Secure Fine Pitch ICs
Price:
$1.35~$2.68(Prices Are Determined According To Different Incoterms And Quantities）
MOQ:
500 pcs
Delivery Time:
10 workdays
Brand:
Hiner-pack
Product Description
Durable Waffle Pack Chip Trays with Uniform Grid to Secure Fine Pitch ICs
Tired of ordinary trays failing to protect compact fine pitch microchips during turnover?
Boast high-density uniform cavity layout to hold numerous tiny components separately. Eliminate mutual friction, displacement and surface damage amid frequent workshop operations.
Deliver sustained electrostatic discharge performance. Keep fragile semiconductor devices safe from static risks and support long-term repeated circulation.
Adapt cavity arrangement and overall sizes according to component specifications. Create exclusive storage solutions to fit various electronic production scenarios.
Key Features/ Benefits
- Constant ESD performance for delicate microchips
- High-density cavities for large-capacity storage
- Stackable design to cut warehouse occupation
- Protects delicate fine pitch IC components efficiently
- Support fully customized cavity sizes and layout designs
Specifications
| Brand | Hiner-pack | ||
| Color | Black | ||
| Outline Line Size | 50.7×50.7×4 mm | ||
| Matrix QTY | 24x23=552 PCS | ||
| Service | Accept OEM, ODM | ||
Applications
Ideal for storing and transporting microchips, integrated circuits and miniature electronic parts. Isolate each component to reduce scratch, collision and electrostatic damage risks.
Well suited for semiconductor factories, component distributors and SMT workshops. Serve chip testing, production transfer and finished product logistics management.
Packaging & Shipping/ Services
We arrange neat palletized packing lined with shockproof fillers. Reinforced export cartons prevent squeezing and impact during sea and air shipments.
Packing quantity can be adjusted as your request. Strict inspection before shipment ensures goods reach your destination in perfect condition.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.
Why Choose Us:
- Rich experience in JEDEC / IC / waffle pack trays
- In-house mold design capability
- Fast prototype development
- Strict QC process
- Stable supply for global semiconductor customers
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Shenzhen Hiner Technology Co., Ltd.
Location
Building A11, Zone D, West Industrial Zone, Minzhu Community, Shajing Street, Baoan District, Shenzhen City, GD Province CN
Contact Person
Zhu