Heavy Duty Waffle Pack Chip Trays with Uniform Grid for Fine Pitch IC Protection
Price:
$1.35~$2.68(Prices Are Determined According To Different Incoterms And Quantities）
MOQ:
500 pcs
Delivery Time:
10 workdays
Brand:
Hiner-pack
Product Description
Heavy Duty Waffle Pack Chip Trays with Uniform Grid for Fine Pitch IC Protection
Looking for dependable carriers to safeguard miniature semiconductor components?
Own abundant independent precision cavities to separate each chip. Avoid mutual collision and surface wear during testing, transfer and inventory arrangement.
Possess lasting conductive performance to resist static hazards. Fully adapt to long-cycle repeated operation inside electronic manufacturing workshops.
Adjust cavity layout and overall dimensions flexibly. Provide personalized storage solutions to satisfy diverse production requirements worldwide.
Key Features/ Benefits
- Steady conductive & anti-static capability
- Durable industrial conductive plastic body
- Stable component holding
- Multiple independent precision cavities
- Precise waffle structure.
Specifications
| Brand | Hiner-pack | ||
| Color | Black | ||
| Outline Line Size | 50.7×50.7×7.4 mm | ||
| Matrix QTY | 22x19=418 PCS | ||
| Service | Accept OEM, ODM | ||
Applications
Suitable for storage and circulation of fine pitch ICs, micro semiconductors and tiny electronic parts. Isolate components to reduce mechanical damage and electrostatic risks.
Ideal for semiconductor factories, component vendors and SMT workshops to complete chip testing, production transfer and stock management work.
Packaging & Shipping/ Services
All goods are packed in reinforced export cartons with shockproof fillers. Internal fixation prevents sliding and extrusion. Uniform packing standards are implemented. Comprehensive pre-shipment inspection ensures safe delivery by sea or air transportation.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.
Why Choose Us:
Rich experience in JEDEC / IC / waffle pack trays
In-house mold design capability
Fast prototype development
Strict QC process
Stable supply for global semiconductor customers
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Shenzhen Hiner Technology Co., Ltd.
Location
Building A11, Zone D, West Industrial Zone, Minzhu Community, Shajing Street, Baoan District, Shenzhen City, GD Province CN
Contact Person
Zhu