Shenzhen Hiner Technology Co., Ltd.
                                                                                                           
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13 Years
Since 2013
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4 Inch MPPO Matte Surface Waffle Pack Chip Trays - 101.57×101.57×3mm with 81 Cavities for Bare-Die Packaging

Price Negotiable
Price: $0.35~$0.85(Prices are determined according to different incoterms and quantities)
MOQ: 1000 pcs
Delivery Time: 5~8 working days
Brand: Hiner-pack
Product Description
Product Overview

Our 4-inch MPPO matte surface waffle pack chip trays are specifically engineered for secure bare-die and small chip packaging applications. These anti-static trays provide reliable protection during transit and storage while maintaining component integrity.

HN21013-1 Model Specifications
ParameterSpecification
BrandHiner-pack
ModelHN21013-1
Outline Dimensions101.57 × 101.57 × 3mm
Cavity Size8.5 × 8.5mm
Matrix Quantity9 × 9 = 81 PCS
MaterialABS
Surface Resistance1.0×10⁴ - 1.0×10¹¹ Ω
FlatnessMAX 0.3mm
ColorBlack
CertificationROHS Compliant
Key Features
  • Matte surface finish for reduced glare and static control
  • Precision grid array with 81 cavities per tray
  • Compatible with covers, clips, and Tyvek paper accessories
  • Durable and reusable construction
  • Environmentally friendly materials
  • Biodegradable options available
Material Options

Available in ABS, PC, MPPO, PPE, and other engineering plastics to meet specific application requirements.

Customization & Services
  • OEM and ODM services available
  • Custom colors and specifications
  • Free samples from existing products
  • Custom samples based on your design requirements
  • Minimum Order Quantity: 500 pieces
  • Standard delivery: 8-10 working days
Applications

Ideal for wafer die, bar chips, PCBA modules, electronic components, and optical device packaging in various industrial settings.

Company Advantages
  • 10+ years of export experience
  • Professional engineering and efficient management
  • ISO certified manufacturing facility
  • ROHS compliant products
  • Global exports to USA, Germany, UK, Korea, Japan, and more
  • 24-hour professional sales support
Product Images
4-inch MPPO matte surface waffle pack chip tray showing 81 cavity grid array Close-up view of MPPO waffle pack tray cavities for bare-die components
Frequently Asked Questions
Can you do OEM and customized design IC trays?
We have strong mold manufacturing and product design capabilities, with extensive experience in mass production of various IC trays.
How long is your delivery time?
Typically 5-8 working days, depending on order quantity and complexity.
Do you provide samples? Are they free or extra?
Yes, we offer samples. Samples may be free or charged based on product value, with shipping costs typically collected or as agreed.
What shipping methods do you support?
We support sea freight, air freight, express delivery, and postal services based on order quantity and volume requirements.

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Shenzhen Hiner Technology Co., Ltd.
Location Building A11, Zone D, West Industrial Zone, Minzhu Community, Shajing Street, Baoan District, Shenzhen City, GD Province CN
Contact Person Zhu

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