Shenzhen Hiner Technology Co., Ltd.
                                                                                                           
Verified Supplier
13 Years
Since 2013
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ABS MPPO Waffle Pack Bare Die Tray 36 PCS 101.57×101.57×3mm Optical Device Packaging

Price Negotiable
Price: $0.35~$0.85(Prices are determined according to different incoterms and quantities)
MOQ: 1000 pcs
Delivery Time: 5~8 working days
Brand: Hiner-pack
Product Description
Product Overview

Our ABS MPPO Waffle Pack Bare Die Tray provides superior semiconductor transport protection with 36 cavities in a 6×6 matrix configuration. This injection-molded tray offers customizable layouts, depths, and cavity counts to meet demanding optical device packaging requirements.

Key Applications
  • Wafer Die / Bar / Chips packaging
  • PCBA module component protection
  • Optical device packaging solutions
  • Component packaging for semiconductors
Technical Specifications
Brand Hiner-pack Outline Size 101.57×101.57×3mm
Model HN21014-2 Package Type IC Parts
Cavity Size 13×13mm Matrix Quantity 6×6=36 PCS
Material ABS Flatness MAX 0.3mm
Color Black Service Accept OEM, ODM
Resistance 1.0×10⁴-1.0×10¹¹Ω Certificate RoHS
Material Options & Customization
Outline Size Material Options Surface Resistance Service Flatness Color
2" ABS, PC, PPE, etc. 1.0×10⁴-1.0×10¹¹Ω OEM, ODM Max 0.2mm Customizable
3" ABS, PC, PPE, etc. 1.0×10⁴-1.0×10¹¹Ω OEM, ODM Max 0.25mm Customizable
4" ABS, PC, PPE, etc. 1.0×10⁴-1.0×10¹¹Ω OEM, ODM Max 0.3mm Customizable
Custom size ABS, PC, PPE, etc. 1.0×10⁴-1.0×10¹¹Ω OEM, ODM TBC Customizable
Competitive Advantages
  • Flexible OEM service with custom design capabilities
  • Multiple material options including MPPO, PPE, ABS, PEI, IDP
  • Complete manufacturing process from tooling to injection molding
  • Comprehensive customer service from consultation to after-sales
  • 12 years of OEM experience for USA and EU customers
  • In-house factory ensuring high quality control and flexible production
Product Images
Waffle pack IC chip tray HN21014-1 showing 36-cavity configuration Waffle pack IC chip tray HN21014-2 detailed view
Frequently Asked Questions
Q: Can you do OEM and customized design IC trays?
A: We have strong mold manufacturing and product design capabilities, with extensive experience in mass production of various IC trays.
Q: How long is your delivery time?
A: Generally 5-8 working days, depending on the actual purchase quantity of orders.
Q: Do you provide samples? Is it free or extra?
A: Yes, we offer samples which may be free or charged according to product value, with shipping costs typically collected or as agreed.
Q: What kind of Incoterms can you do?
A: We support Ex works, FOB, CNF, CIF, CFR, DDU, DAP and other incoterms as agreed.
Q: What method can you use to ship the goods?
A: By sea, by air, by express, or by mail post according to customer order quantity and volume.

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Shenzhen Hiner Technology Co., Ltd.
Location Building A11, Zone D, West Industrial Zone, Minzhu Community, Shajing Street, Baoan District, Shenzhen City, GD Province CN
Contact Person Zhu

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