Shenzhen Hiner Technology Co., Ltd.
                                                                                                           
Verified Supplier
13 Years
Since 2013
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4 Inch Waffle Pack Chip Trays with 63 Pockets 6.62×8.29×0.8mm ESD Anti-Static Protection for Electronic Components

Price Negotiable
Price: $0.35~$0.85(Prices are determined according to different incoterms and quantities)
MOQ: 1000 pcs
Delivery Time: 5~8 working days
Brand: Hiner-pack
Product Description
Customized high-temperature resistant Waffle Pack for carrying tiny modules and electronic components with ESD protection.
Product Overview
Hiner-pack production IC tray complies with international environmental standards, passing ROHS and SGS third-party inspections. Raw materials are sourced from leading domestic manufacturers with strict quality control throughout production. All products are 100% quality confirmed before shipment and have been supplied to domestic and international customers with positive feedback.
Key Benefits
  • Presents non-standard components to Pick and Place machines
  • Multiple uses including component bake-out, storage, and shipping
  • Cost-effective alternative to "tape and reel" or hand placement
  • Small size and light weight for low transportation costs
  • Each tray accommodates large quantities of chips for testing and transfer
  • Stable anti-static performance protects chips from ESD damage
  • Excellent flatness for easy operation on automatic equipment
  • Compatible with covers and clips for various shipping methods
  • Recyclable plastic material that degrades easily with no environmental concerns
  • Stackable design with maximum tray matrix utilization
Applications
  • Wafer Die / Bar / Chips
  • PCBA module components
  • Electronic component packaging
  • Optical device packaging
Technical Specifications
Parameter Specification
Model Reference HN21016
Material PC (Polycarbonate)
Color Black
Matrix Quantity 9×7=63 Pockets
Pocket Size 6.62×8.29×0.8mm
Overall Dimensions Customizable per customer requirements
Features Durable, Reusable, Eco-friendly, Biodegradable
Accessories Cover/Lid, Clip/Clamp, Tyvek paper
Artwork Format PDF, 2D, 3D
Waffle Pack IC Tray HN21016 with 63 pockets for electronic components
Customization & Samples
Free Samples: Available from existing products
Customized Samples: Provided according to your design requirements
Frequently Asked Questions
Q: Can you do OEM and customized design IC trays?
A: We have strong mold manufacturing and product design capabilities, with extensive experience in mass production of various IC trays.
Q: How long is your delivery time?
A: Typically 5-8 working days, depending on order quantity.
Q: Do you provide samples? Is it free or extra?
A: Yes, we provide samples. Samples may be free or charged based on product value, with shipping costs normally collected or as agreed.
Q: What kind of Incoterms can you do?
A: We support Ex works, FOB, CNF, CIF, CFR, DDU, DAP and other incoterms as agreed.
Q: What method can you use to ship the goods?
A: By sea, air, express, mail, or post, depending on order quantity and volume.
Waffle Pack IC Tray HN21016 showing stackable design and pocket details

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Shenzhen Hiner Technology Co., Ltd.
Location Building A11, Zone D, West Industrial Zone, Minzhu Community, Shajing Street, Baoan District, Shenzhen City, GD Province CN
Contact Person Zhu

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