Shenzhen Hiner Technology Co., Ltd.
                                                                                                           
Verified Supplier
13 Years
Since 2013
Menu

ESD Antistatic Matrix Chip Waffle Tray 2-4 Inch with 1.0x10⁴-1.0x10¹¹Ω Resistance for IC Component Protection

Price Negotiable
Price: $0.35~$0.85(Prices are determined according to different incoterms and quantities)
MOQ: 1000 pcs
Delivery Time: 5~8 working days
Brand: Hiner-pack
Product Description
ESD Antistatic Matrix Chip Waffle Tray
Product Overview

Professional IC packaging delivery system designed for protecting and transporting bare die, CSP, known good die (KGD), chip scale packaging (CSP), and wafer scale packaging (WSP) components.

Key Features
  • ESD antistatic protection with surface resistance range of 1.0x10⁴-1.0x10¹¹Ω
  • Excellent moisture protection in normal environments
  • Superior mechanical strength and heat resistance
  • Outstanding impact resistance and chemical corrosion resistance
  • Stable anti-static performance unaffected by environment, time, or temperature
  • SGS approved and RoHS compliant
Standard Specifications
Outline Size Material Surface Resistance Flatness Color
2" ABS, PC, PPE, etc. 1.0x10⁴-1.0x10¹¹Ω Max 0.2mm Customizable
3" ABS, PC, PPE, etc. 1.0x10⁴-1.0x10¹¹Ω Max 0.25mm Customizable
4" ABS, PC, PPE, etc. 1.0x10⁴-1.0x10¹¹Ω Max 0.3mm Customizable
Custom size ABS, PC, PPE, etc. 1.0x10⁴-1.0x10¹¹Ω TBC Customizable
Sample Model Specifications
Parameter Value Parameter Value
Outline Line Size 50×50×4mm Brand Hiner-pack
Model HN 210×210-24 Package Type IC Parts
Cavity Size 5.33×5.33×6.1mm Matrix QTY 7×7=49PCS
Material ABS Flatness MAX 0.2mm
Color Black Service Accept OEM, ODM
Resistance 1.0x10⁴-1.0x10¹¹Ω Certificate ROHS
Material Options

Available in ESD conductive, antistatic, or standard materials to meet specific application requirements.

Applications
  • IC components
  • Electronic components
  • Semiconductor devices
  • Micro and nano systems
  • Sensor IC components
ESD Antistatic Matrix Chip Waffle Tray product image showing IC component protection design
Frequently Asked Questions
Can you do OEM and customized design IC tray?
We have strong mold manufacturing and product design capabilities, with extensive experience in mass production of various IC trays.
How long is your delivery time?
Typically 5-8 working days, depending on the actual purchase quantity of orders.
Do you provide samples? Is it free or extra?
Yes, we offer samples which may be free or charged based on product value, with shipping costs typically collected or as agreed.
What kind of Incoterm can you support?
We support Ex works, FOB, CNF, CIF, CFR, DDU, DAP, and other incoterms as agreed.
What shipping methods do you offer?
By sea, by air, or by express/mail post according to customer order quantity and volume.
ESD Antistatic Matrix Chip Waffle Tray detailed specifications and dimensional diagram

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Shenzhen Hiner Technology Co., Ltd.
Location Building A11, Zone D, West Industrial Zone, Minzhu Community, Shajing Street, Baoan District, Shenzhen City, GD Province CN
Contact Person Zhu

Request A Quote

Please check your email address.
Your message must be at least 20 characters.