Bicheng Technologies Limited
                                                                                                           
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Since 2003
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Double Sided 2-layer Rogers PCB Built on 8mil RO4003C High Temperature Substrates with Immersion Gold on Pads

Price Negotiable
Price: 0.99-99.99
MOQ: 1 piece
Delivery Time: Negotiable
Brand: BICHENG
Product Description

Double Sided 2-layer Rogers PCB Built on 8mil RO4003C High Temperature Substrates with Immersion Gold on Pads

 

We are excited to announce the release of our latest RF PCB on May 26th 2003.

 

This high-quality PCB is designed to meet the needs of a wide range of electronic applications, featuring Rogers RO4003C material and a lead-free process that allows for operation in temperatures ranging from -40℃ to +85℃.

 

The board has a 2-layer stackup with a base copper of 35um, dielectric of 8mil, and base copper of 35um. It has a finished board thickness of 0.37mm and a finished Cu weight of 1.5 oz (2.1 mils) for all layers. The board dimensions are 110.00 x 85.00 mm, with a tolerance of +/- 0.15mm.

 

With a minimum trace/space of 5/5 mils and a minimum hole size of 15 mils, this PCB is highly versatile for various electronic applications. It has no blind or buried vias and plated slotted holes defined as per Gerber. The surface finish is ENIG, and the top silkscreen is absent, while the bottom silkscreen is also absent, and top/bottom solder masks are green/no.

 

The PCB has 90 components, 341 total pads, 169 thru-hole pads, 67 top SMT pads, 105 bottom SMT pads, 215 vias, and 236 nets, making it a high-performance PCB suitable for various electronic applications. Impedance matching is not included.

 

A panelized solder paste stencil is provided for the top sides, ensuring accurate and efficient soldering. For technical inquiries or questions, please contact Bicheng Limited via sales@bicheng-enterprise.com.

 

Specifications Value
PCB Material Rogers RO4003C
Lead-free process Yes
Operating temperature -40℃ to +85℃
Stackup 2-layer PCB
Base copper 35um
Dielectric 8mil
Base copper 35um
Construction details Board dimensions: 110.00 x 85.00 mm=4 Types = 4 PCS, +/- 0.15mm
Minimum Trace/Space: 5/5 mils
Minimum Hole Size: 15 mils
No blind or buried vias
Plated slotted holes defined as per Gerber
Finished board thickness: 0.37 mm
Breakouts in panel as per design, aligned with board breakouts
Panelization details as per Gerber
All edges tab-routed, non-plated holes for breakouts included in Gerbers, breakouts shown as per design FabDrawing
Finished Cu weight: 1.5 oz (2.1 mils) all layers
Via plating thickness: 1 mil
Surface finish: ENIG
Top Silkscreen: No
Bottom Silkscreen: No
Top/Bottom Solder Mask: Green/No
No silkscreen on solder pads
100% Electrical test used
Impedance matching No, +/- 10%
Solder paste stencil Panelized for top sides
PCB Statistics Components: 90
Total Pads: 341
Thru Hole Pads: 169
Top SMT Pads: 67
Bottom SMT Pads: 105
Vias: 215
Nets: 236

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Bicheng Technologies Limited
Location 6-11C Shidai Jingyuan, Fuyong Town, Baoan District, Zhenzhen City, Guangdong, China
Contact Person Natalie Xue

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