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Rogers PCB Made on RO3035 10mil 0.254mm DK3.5 with Immersion Gold for Patch Antenna for Wireless Communications

Price Negotiable
Price: USD9.99-99.99
MOQ: 1
Delivery Time: 10 working days
Brand: Bicheng Technologies Limited
Product Description

Rogers PCB Made on RO3035 10mil 0.254mm DK3.5 with Immersion Gold for Patch Antenna for

Wireless Communications

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

Given the properties and typical applications of Rogers RO3035 high-frequency circuit materials, here is a

summary: 

 

Properties of RO3035 Material:


Composition: Ceramic-filled PTFE composites.


Stability: Exceptional electrical and mechanical stability.


Mechanical Properties: Consistent, enabling multi-layer board designs without warping issues.


Thermal Expansion:


X and Y Axis: 17 ppm/°C (matched to copper for dimensional stability).


Z Axis: 24 ppm/°C, ensuring plated through-hole reliability.


Typical Applications:


Automotive Radar: Used in radar systems for automotive applications.


Cellular Telecommunications Systems: Employed in cellular infrastructure for communication.


Datalink on Cable Systems: Utilized for data transmission within cable networks.


Direct Broadcast Satellites: Essential for satellite communication and broadcasting.


Global Positioning Satellite Antennas: Employed in GPS antenna systems for accurate positioning.


Patch Antennas for Wireless Communications: Critical for wireless communication systems.


Power Amplifiers and Antennas: Integral components in RF power amplification and antenna systems.


Power Backplanes: Used in power distribution systems for efficient power management.


Remote Meter Readers: Applied in systems for remote data collection and monitoring.


The exceptional properties of RO3035 materials make them ideal for various commercial microwave and

RF applications where stability, reliability, and performance are crucial. Their compatibility with multi-layer

board designs and dimensional stability make them particularly suitable for applications requiring precision

and consistency in harsh environments.

 

 

PCB Specifications

PCB SIZE 55 x 57mm=1PCS
BOARD TYPE Double sided PCB
Number of Layers 2 layers
Surface Mount Components YES
Through Hole Components YES
LAYER STACKUP copper ------- 18um(0.5 oz)+plate TOP layer
RO3035 0.254mm
copper ------- 18um(0.5 oz) + plate BOT Layer
TECHNOLOGY  
Minimum Trace and Space: 4 mil / 4 mil
Minimum / Maximum Holes: 0.4 mm / 5.5 mm
Number of Different Holes: 5
Number of Drill Holes: 79
Number of Milled Slots: 0
Number of Internal Cutouts: 0
Impedance Control: no
Number of Gold finger: 0
BOARD MATERIAL  
Glass Epoxy: RO3035 0.254mm
Final foil external: 1 oz
Final foil internal: N/A
Final height of PCB: 0.3 mm ±0.1
PLATING AND COATING  
Surface Finish Immersion gold
Solder Mask Apply To: N/A
Solder Mask Color: N/A
Solder Mask Type: N/A
CONTOUR/CUTTING Routing
MARKING  
Side of Component Legend N/A
Colour of Component Legend N/A
Manufacturer Name or Logo: N/A
VIA Plated through hole(PTH), minimum size 0.4mm.
FLAMIBILITY RATING UL 94-V0 Approval MIN.
DIMENSION TOLERANCE  
Outline dimension: 0.0059"
Board plating: 0.0029"
Drill tolerance: 0.002"
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.

 

 

 

Data Sheet of Rogers 3035 (RO3035)

Property RO3035 Direction Units Condition Test Method
Dielectric Constant,εProcess 3.50±0.05 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign 3.6 Z   8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.0015 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5
Thermal Coefficient of ε -45 Z ppm/℃ 10 GHz -50℃to 150℃ IPC-TM-650 2.5.5.5
Dimensional Stability 0.11
0.11
X
Y
mm/m COND A IPC-TM-650 2.2.4
Volume Resistivity 107   MΩ.cm COND A IPC 2.5.17.1
Surface Resistivity 107   COND A IPC 2.5.17.1
Tensile Modulus 1025
1006
X
Y
MPa 23℃ ASTM D 638
Moisture Absorption 0.04   % D48/50 IPC-TM-650 2.6.2.1
Specific Heat     j/g/k   Calculated
Thermal Conductivity 0.5   W/M/K 50℃ ASTM D 5470
Coefficient of Thermal Expansion
(-55 to 288℃)
17
17
24
X
Y
Z
ppm/℃ 23℃/50% RH IPC-TM-650 2.4.4.1
Td 500   ℃ TGA   ASTM D 3850
Density 2.1   gm/cm3 23℃ ASTM D 792
Copper Peel Stength 10.2   Ib/in. 1oz,EDC After Solder Float IPC-TM 2.4.8
Flammability V-0       UL 94
Lead-free Process Compatible Yes        

 

 

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Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Bicheng Technologies Limited
Location 6-11C Shidai Jingyuan, Fuyong Town, Baoan District, Zhenzhen City, Guangdong, China
Contact Person Natalie Xue

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