Rogers RO3035 30mil 0.762mm High Frequency PCB DK3.5 RF PCB for Datalink On Cable Systems
Rogers RO3035 30mil 0.762mm High Frequency PCB DK3.5 RF PCB for Datalink On Cable
Systems
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for
reference)
The Rogers RO3035 high-frequency circuit materials are ceramic-filled PTFE composites developed
for commercial microwave and RF applications. These materials are designed to offer exceptional
electrical and mechanical stability at competitive prices, making them ideal for a variety of high
-frequency applications. The key features and typical applications of RO3035 materials are as
follows:
Key Features:
Consistent Mechanical Properties: RO3035 materials provide consistent mechanical properties,
enabling the design of multi-layer boards without warping or reliability issues.
Thermal Expansion Properties: The material exhibits a coefficient of thermal expansion (CTE) of
17 ppm/°C in the X and Y axes, matched to copper. This alignment ensures excellent dimensional
stability, with minimal etch shrinkage of less than 0.5 mils per inch after etching and baking.
Z-Axis CTE: With a Z-axis CTE of 24 ppm/°C, RO3035 materials offer exceptional reliability for plated
through-holes, even in severe environmental conditions.
Typical Applications:
Automotive Radar: Used in radar systems for automotive applications.
Cellular Telecommunications Systems: Employed in cellular network infrastructure.
Datalink on Cable Systems: Utilized for data transmission in cable systems.
Direct Broadcast Satellites: Integral in direct satellite communication and broadcasting.
Global Positioning Satellite Antennas: Essential for GPS antenna systems.
Patch Antennas for Wireless Communications: Critical for wireless communication systems.
Power Amplifiers and Antennas: Used in RF power amplification and antenna systems.
Power Backplanes: Deployed in power distribution systems for efficient power management.
Remote Meter Readers: Applied in systems for remote data collection and monitoring.
The versatility and reliability of RO3035 materials make them well-suited for a wide range of high-frequency
applications, providing excellent electrical properties, mechanical stability, and reliability even in demanding
environments.
PCB Specifications
| PCB SIZE | 140 x 52mm=20PCS |
| BOARD TYPE | Double sided PCB |
| Number of Layers | 2 layers |
| Surface Mount Components | YES |
| Through Hole Components | YES |
| LAYER STACKUP | copper ------- 18um(0.5 oz)+plate TOP layer |
| RO3035 0.762mm | |
| copper ------- 18um(0.5 oz) + plate BOT Layer | |
| TECHNOLOGY | |
| Minimum Trace and Space: | 4 mil / 4 mil |
| Minimum / Maximum Holes: | 0.5 mm / 5.0 mm |
| Number of Different Holes: | 11 |
| Number of Drill Holes: | 125 |
| Number of Milled Slots: | 0 |
| Number of Internal Cutouts: | 0 |
| Impedance Control: | no |
| Number of Gold finger: | 0 |
| BOARD MATERIAL | |
| Glass Epoxy: | RO3035 0.762mm |
| Final foil external: | 1oz |
| Final foil internal: | N/A |
| Final height of PCB: | 0.8 mm ±0.1mm |
| PLATING AND COATING | |
| Surface Finish | Immersion Gold |
| Solder Mask Apply To: | N/A |
| Solder Mask Color: | N/A |
| Solder Mask Type: | LPSM |
| CONTOUR/CUTTING | Routing |
| MARKING | |
| Side of Component Legend | N/A |
| Colour of Component Legend | N/A |
| Manufacturer Name or Logo: | N/A |
| VIA | Plated through hole(PTH), minimum size 0.5mm. |
| FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
| DIMENSION TOLERANCE | |
| Outline dimension: | 0.0059" |
| Board plating: | 0.0029" |
| Drill tolerance: | 0.002" |
| TEST | 100% Electrical Test prior shipment |
| TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
| SERVICE AREA | Worldwide, Globally. |
Data Sheet of Rogers 3035 (RO3035)
| Property | RO3035 | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 3.50±0.05 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline | |
| Dielectric Constant,εDesign | 3.6 | Z | 8GHz to 40 GHz | Differential Phase Length Method | |
| Dissipation Factor,tanδ | 0.0015 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 | |
| Thermal Coefficient of ε | -45 | Z | ppm/℃ | 10 GHz -50℃to 150℃ | IPC-TM-650 2.5.5.5 |
| Dimensional Stability | 0.11 0.11 |
X Y |
mm/m | COND A | IPC-TM-650 2.2.4 |
| Volume Resistivity | 107 | MΩ.cm | COND A | IPC 2.5.17.1 | |
| Surface Resistivity | 107 | MΩ | COND A | IPC 2.5.17.1 | |
| Tensile Modulus | 1025 1006 |
X Y |
MPa | 23℃ | ASTM D 638 |
| Moisture Absorption | 0.04 | % | D48/50 | IPC-TM-650 2.6.2.1 | |
| Specific Heat | j/g/k | Calculated | |||
| Thermal Conductivity | 0.5 | W/M/K | 50℃ | ASTM D 5470 | |
| Coefficient of Thermal Expansion (-55 to 288℃) |
17 17 24 |
X Y Z |
ppm/℃ | 23℃/50% RH | IPC-TM-650 2.4.4.1 |
| Td | 500 | ℃ TGA | ASTM D 3850 | ||
| Density | 2.1 | gm/cm3 | 23℃ | ASTM D 792 | |
| Copper Peel Stength | 10.2 | Ib/in. | 1oz,EDC After Solder Float | IPC-TM 2.4.8 | |
| Flammability | V-0 | UL 94 | |||
| Lead-free Process Compatible | Yes |
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