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Rogers RO3035 30mil 0.762mm High Frequency PCB DK3.5 RF PCB for Datalink On Cable Systems

Price Negotiable
Price: USD9.99-99.99
MOQ: 1
Delivery Time: 10 working days
Brand: Bicheng Technologies Limited
Product Description

Rogers RO3035 30mil 0.762mm High Frequency PCB DK3.5 RF PCB for Datalink On Cable

Systems

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for

reference)

 

The Rogers RO3035 high-frequency circuit materials are ceramic-filled PTFE composites developed

for commercial microwave and RF applications. These materials are designed to offer exceptional

electrical and mechanical stability at competitive prices, making them ideal for a variety of high

-frequency applications. The key features and typical applications of RO3035 materials are as

follows:

 

Key Features:
Consistent Mechanical Properties:
RO3035 materials provide consistent mechanical properties,

enabling the design of multi-layer boards without warping or reliability issues.


Thermal Expansion Properties: The material exhibits a coefficient of thermal expansion (CTE) of

17 ppm/°C in the X and Y axes, matched to copper. This alignment ensures excellent dimensional

stability, with minimal etch shrinkage of less than 0.5 mils per inch after etching and baking.


Z-Axis CTE: With a Z-axis CTE of 24 ppm/°C, RO3035 materials offer exceptional reliability for plated

through-holes, even in severe environmental conditions.


Typical Applications:
Automotive Radar: Used in radar systems for automotive applications.


Cellular Telecommunications Systems: Employed in cellular network infrastructure.


Datalink on Cable Systems: Utilized for data transmission in cable systems.


Direct Broadcast Satellites: Integral in direct satellite communication and broadcasting.


Global Positioning Satellite Antennas: Essential for GPS antenna systems.


Patch Antennas for Wireless Communications: Critical for wireless communication systems.


Power Amplifiers and Antennas: Used in RF power amplification and antenna systems.


Power Backplanes: Deployed in power distribution systems for efficient power management.


Remote Meter Readers: Applied in systems for remote data collection and monitoring.


The versatility and reliability of RO3035 materials make them well-suited for a wide range of high-frequency

applications, providing excellent electrical properties, mechanical stability, and reliability even in demanding

environments.

 

 

PCB Specifications

PCB SIZE 140 x 52mm=20PCS
BOARD TYPE Double sided PCB
Number of Layers 2 layers
Surface Mount Components YES
Through Hole Components YES
LAYER STACKUP copper ------- 18um(0.5 oz)+plate TOP layer
RO3035 0.762mm
copper ------- 18um(0.5 oz) + plate BOT Layer
TECHNOLOGY  
Minimum Trace and Space: 4 mil / 4 mil
Minimum / Maximum Holes: 0.5 mm / 5.0 mm
Number of Different Holes: 11
Number of Drill Holes: 125
Number of Milled Slots: 0
Number of Internal Cutouts: 0
Impedance Control: no
Number of Gold finger: 0
BOARD MATERIAL  
Glass Epoxy: RO3035 0.762mm
Final foil external: 1oz
Final foil internal: N/A
Final height of PCB: 0.8 mm ±0.1mm
PLATING AND COATING  
Surface Finish Immersion Gold
Solder Mask Apply To: N/A
Solder Mask Color: N/A
Solder Mask Type: LPSM
CONTOUR/CUTTING Routing
MARKING  
Side of Component Legend N/A
Colour of Component Legend N/A
Manufacturer Name or Logo: N/A
VIA Plated through hole(PTH), minimum size 0.5mm.
FLAMIBILITY RATING UL 94-V0 Approval MIN.
DIMENSION TOLERANCE  
Outline dimension: 0.0059"
Board plating: 0.0029"
Drill tolerance: 0.002"
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.

 

 

 

Data Sheet of Rogers 3035 (RO3035)

Property RO3035 Direction Units Condition Test Method
Dielectric Constant,εProcess 3.50±0.05 Z   10 GHz/23 IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign 3.6 Z   8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.0015 Z   10 GHz/23 IPC-TM-650 2.5.5.5
Thermal Coefficient of ε -45 Z ppm/ 10 GHz -50to 150 IPC-TM-650 2.5.5.5
Dimensional Stability 0.11
0.11
X
Y
mm/m COND A IPC-TM-650 2.2.4
Volume Resistivity 107   MΩ.cm COND A IPC 2.5.17.1
Surface Resistivity 107   COND A IPC 2.5.17.1
Tensile Modulus 1025
1006
X
Y
MPa 23 ASTM D 638
Moisture Absorption 0.04   % D48/50 IPC-TM-650 2.6.2.1
Specific Heat     j/g/k   Calculated
Thermal Conductivity 0.5   W/M/K 50 ASTM D 5470
Coefficient of Thermal Expansion
(-55 to 288
)
17
17
24
X
Y
Z
ppm/ 23/50% RH IPC-TM-650 2.4.4.1
Td 500   TGA   ASTM D 3850
Density 2.1   gm/cm3 23 ASTM D 792
Copper Peel Stength 10.2   Ib/in. 1oz,EDC After Solder Float IPC-TM 2.4.8
Flammability V-0       UL 94
Lead-free Process Compatible Yes        

 

 

 

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Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Bicheng Technologies Limited
Location 6-11C Shidai Jingyuan, Fuyong Town, Baoan District, Zhenzhen City, Guangdong, China
Contact Person Natalie Xue

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