4 Layer High Frequency PCB Built On 6.6mil and 20mil RO4350B with Blind Via for Radar Sensor
4 Layer High Frequency PCB Built On 6.6mil and 20mil RO4350B with Blind Via for Radar Sensor
(Printed circuit boards are custom-made products, the picture and parameters shown are just for reference)
Hi Everyone,
Multilayer Rogers PCBs are constructed using multiple cores combined, distinguishing them from FR-4
multilayer PCBs. In the RO4350B family, there are 8 cores available, ranging from 4 mil (0.101 mm) to
60 mil (1.524 mm) in thickness. This diversity in core options allows for a wide range of design possibilities
and performance characteristics in Rogers PCBs, setting them apart from traditional FR-4 boards.
| RO4350B: | |
| 4mil | 0.101mm |
| 6.6mil | 0.168mm |
| 10mil | 0.254mm |
| 13.3mil | 0.338mm |
| 16.6mil | 0.422mm |
| 20mil | 0.508mm |
| 30mil | 0.762mm |
| 60mil | 1.524mm |
So it’s very interesting that the stack-up of 4 layers can be configured in numerous ways.
Today, we are focusing on Rogers 4-layer PCBs fabricated using 6.6 mil and 20 mil RO4350B substrates.
Let’s begin by examining the first stack-up configuration.
Layer 1 to Layer 2 comprises the first core of 6.6 mil, while Layer 3 to Layer 4 consists of the second
core of 20 mil. These cores are interconnected through two sheets of RO4450F (1 RO4450F = 4 mil).
This specific board is tailored for radar sensor applications, with a thickness of 1.0 mm and pads featuring
immersion gold plating. It incorporates blind vias from the top layer to the inner layer 1.
Given its asymmetric build, a maximum warpage of 1.2% is permissible. Manufactured in compliance with
IPC 6012 Class 2 standards, this board is produced using provided Gerber data. Each shipment contains
10 boards securely packed for transportation.
The second one is very similar to previous one, the stack-up explains all.
Features and Benefits
Dielectric Constant (DK):
Low and stable DK ensures excellent signal transmission without delay.
Immersion Gold Surface:
Provides exceptional surface planarity, especially beneficial for PCBs with BGA or CSP components,
reducing failure rates during assembly and soldering.
Comprehensive Testing:
Includes electrical tests, AOI inspection, thermal stress tests, reliability tests, insulation resistance tests,
and ionic contamination tests for quality assurance.
Fast and Flexible Production:
Enables quick transition from prototype to standard production, saving valuable time.
Compliance:
UL recognized and RoHS Directive-compliant, ensuring adherence to industry standards.
Why Choose Us?
Focus on Core Competencies:
Let us handle the complexities of PCB manufacturing while you focus on core competencies like research,
development, sales, and marketing.
Cutting-edge Technology:
Access the latest equipment and manufacturing expertise through our three factory bases spanning over
26,000 square meters.
Cost Efficiency:
We prioritize reducing manufacturing costs through equipment upgrades, worker training, and technology
improvements, ensuring quality without compromising profitability.
Quality Assurance:
Our engineering design minimizes quality issues pre-production, resulting in a customer complaint rate of
less than 1%, promptly resolved to your satisfaction.
Time Savings:
Responding to market demands, we offer fast and flexible production schedules, from prototypes to standard
production, ensuring quick turnarounds and scheduled deliveries.
Expert Team:
Trust our passionate, disciplined, responsible, and honest team of experienced salespersons and skilled customer service representatives. Stick with Bicheng for reliability and excellence.
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.



