Double Sided 2-layer Rogers PCB Built on 62mil 1.575mm Low Loss RT/duroid 5880 Substrates with Hot Air Soldering Level H
Double Sided 2-layer Rogers PCB Built on 62mil 1.575mm Low Loss RT/duroid 5880 Substrates with Hot Air Soldering Level HASL Finish
We are pleased to announce the launch of our latest RF PCB in May of 2023. This high-quality PCB is designed to meet the needs of a wide range of electronic applications, featuring Rogers RT/duroid 5880 material and a lead-free process that allows for operation in temperatures ranging from -40℃ to +85℃.
The board has a 2-layer stackup with a base copper of 35um, a dielectric layer of 62mil, and a base copper of 35um. It has a finished board thickness of 1.7mm and a finished Cu weight of 1.5 oz (2.1 mils) for all layers. The board dimensions are 58.00 x 48.00 mm, with a tolerance of +/- 0.15mm.
With a minimum trace/space of 6/6 mils and a minimum hole size of 15 mils, this PCB is highly versatile for various electronic applications. It has no blind or buried vias and plated slotted holes defined as per Gerber. The surface finish is HASL lead-free, and the top silkscreen, bottom silkscreen, and top/bottom solder masks are absent.
The PCB has 30 components, 64 total pads, 36 thru-hole pads, 18 top SMT pads, 10 bottom SMT pads, 96 vias, and 99 nets, making it a high-performance PCB suitable for various electronic applications. Impedance matching is not included.
A panelized solder paste stencil is provided for the top sides, ensuring accurate and efficient soldering. For technical inquiries or questions, please contact Bicheng Limited via sales@bicheng-enterprise.com.
| Specifications | Value |
| PCB Material | Rogers RT/duroid 5880 |
| Lead-free process | Yes |
| Operating temperature | -40℃ to +85℃ |
| Stackup | 2-layer PCB |
| Base copper 35um | |
| Dielectric 62mil | |
| Base copper 35um | |
| Construction details | Board dimensions: 58.00 x 48.00 mm = 2 Types = 2 PCS, +/- 0.15mm |
| Minimum Trace/Space: 6/6 mils | |
| Minimum Hole Size: 15 mils | |
| No blind or buried vias | |
| Plated slotted holes defined as per Gerber | |
| Finished board thickness: 1.7 mm | |
| Breakouts in panel as per design, aligned with board breakouts | |
| Panelization details as per Gerber | |
| All edges tab-routed, non-plated holes for breakouts included in Gerbers, breakouts shown as per design FabDrawing | |
| Finished Cu weight: 1.5 oz (2.1 mils) all layers | |
| Via plating thickness: 1 mil | |
| Surface finish: HASL lead-free | |
| Top Silkscreen: No | |
| Bottom Silkscreen: No | |
| Top/Bottom Solder Mask: No | |
| 100% Electrical test used | |
| Impedance matching | No, +/- 10% |
| Solder paste stencil | Panelized for top sides |
| PCB Statistics | Components: 30 |
| Total Pads: 64 | |
| Thru Hole Pads: 36 | |
| Top SMT Pads: 18 | |
| Bottom SMT Pads: 10 | |
| Vias: 96 | |
| Nets: 99 |
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