Double Sided Dual Layer Rogers PCB Built on 25mil 0.635mm RO3006 High Frequency Material with ENIG Finish on Pads
Double Sided Dual Layer Rogers PCB Built on 25mil 0.635mm RO3006 High Frequency Material with ENIG Finish on Pads
We are excited to announce our newest RF PCB in May of 2023. This high-performance PCB is designed to meet the needs of various electronic applications, featuring Rogers RO3006 material and a lead-free process that allows for operation in temperatures ranging from -40℃ to +85℃.
The board has a 2-layer stackup with a base copper of 17um, a dielectric layer of 25mil, and a base copper of 17um. It has a finished board thickness of 0.8mm and a finished Cu weight of 1 oz (1.4 mils) for all layers. The board dimensions are 156.00 x 122.00 mm, with a tolerance of +/- 0.15mm.
With a minimum trace/space of 6/5 mils and a minimum hole size of 17 mils, this PCB is highly versatile for various electronic applications. It has no blind or buried vias and plated slotted holes defined as per Gerber. The surface finish is immersion gold (ENIG), and the top silkscreen is black, with no silkscreen on the solder pads.
The PCB has 98 components, 286 total pads, 166 thru-hole pads, 58 top SMT pads, 62 bottom SMT pads, 88 vias, and 170 nets, making it a high-performance PCB suitable for various electronic applications. Impedance matching is not included.
A panelized solder paste stencil is provided for the top sides, ensuring accurate and efficient soldering. For technical inquiries or questions, please contact Bicheng Limited via sales@bicheng-enterprise.com.
| Specifications | Value |
| PCB Material | Rogers RO3006 |
| Lead-free process | Yes |
| Operating temperature | -40℃ to +85℃ |
| Stackup | 2-layer PCB |
| Base copper 17um | |
| Dielectric 25mil | |
| Base copper 17um | |
| Construction details | Board dimensions: 156.00 x 122.00 mm = 3 Types = 3 PCS, +/- 0.15mm |
| Minimum Trace/Space: 6/5 mils | |
| Minimum Hole Size: 17 mils | |
| No blind or buried vias | |
| Plated slotted holes defined as per Gerber | |
| Finished board thickness: 0.8 mm | |
| Breakouts in panel as per design, aligned with board breakouts | |
| Panelization details as per Gerber | |
| All edges tab-routed, non-plated holes for breakouts included in Gerbers, breakouts shown as per design FabDrawing | |
| Finished Cu weight: 1 oz (1.4 mils) all layers | |
| Via plating thickness: 1 mil | |
| Surface finish: Immersion gold (ENIG) | |
| Top Silkscreen: Black | |
| Bottom Silkscreen: No | |
| Top/Bottom Solder Mask: No | |
| No silkscreen on solder pads | |
| 100% Electrical test used | |
| Impedance matching | No, +/- 10% |
| Solder paste stencil | Panelized for top sides |
| PCB Statistics | Components: 98 |
| Total Pads: 286 | |
| Thru Hole Pads: 166 | |
| Top SMT Pads: 58 | |
| Bottom SMT Pads: 62 | |
| Vias: 88 | |
| Nets: 170 |
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