DiClad 527 High Frequency PCB (DiClad 527 HF PCB) is a custom-made printed circuit board (PCB) product

Price Negotiable

Price: 0.99-99.99

MOQ: 1 piece

Delivery Time: 8-9working days

Brand: BICHENG

Product Description

DiClad 527 High Frequency PCB (DiClad 527 HF PCB) is a custom-made printed circuit board (PCB) product. The provided

picture and parameters serve as reference only.

Substrate Introduction:

Rogers DiClad 527 laminates are composite materials reinforced with woven fiberglass, primarily used as substrates in PCBs.

These laminates have a higher proportion of fiberglass reinforcement compared to PTFE content. This balanced ratio results

in a wider range of dielectric constant (Dk), improved dimensional stability, and registration.

Standard Panel Sizes for DiClad 527:

Standard Thicknesses for DiClad 527:

Standard Claddings for DiClad 527:

For information on other available PCB configurations, such as additional thicknesses, panel sizes, and claddings, please

contact our Customer Service or Sales Engineering teams.

Key Features:

Key Benefits:

Our PCB Capability (DiClad 527)

PCB Material:	Woven Fiberglass/PTFE composite
Designation:	DiClad 527
Dielectric constant:	2.40-2.60 10GHz/23˚C
Dissipation factor	0.0017 10GHz/23˚C
Layer count:	Single Sided, Double Sided, Multi-layer PCB, Hybrid PCB
Copper weight:	1oz (35µm), 2oz (70µm)
Dielectric thickness	20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm)
PCB size:	≤400mm X 500mm
Solder mask:	Green, Black, Blue, Yellow, Red etc.
Surface finish:	Immersion gold, HASL, Immersion silver, Immersion tin, ENEPIG, OSP, Bare copper, Pure gold etc..

Typical Applications:

DiClad 527 Data Sheet

Typical Value
Properties		DiClad 527	Units	Test Conditions		Test Method
Electrical Properties
Dielectric Constant		2.40-2.60	-	23˚C @ 50% RH	10 GHz	IPC TM-650 2.5.5.5
Dielectric Constant		2.40-2.60	-	23˚C @ 50% RH	1 MHz	IPC TM-650 2.5.5.3
Dissapation Factor		0.0017		23˚C @ 50% RH	10 GHz	IPC TM-650 2.5.5.5
Dissapation Factor		0.0010		23˚C @ 50% RH	1 MHz	IPC TM-650 2.5.5.3
Thermal Coefficient of Dielectric Constant		-153	ppm/˚C	-10 to 140˚C	10 GHz	IPC TM-650 2.5.5.5
Volume Resistivity		1.2 x 109	MΩ-cm	C96/35/90	-	IPC TM-650 2.5.17.1
Surface Resistivity		4.5 x 107	MΩ	C96/35/90	-	IPC TM-650 2.5.17.1
Dielectric Breakdown		>45	kV	D48/50	-	ASTM D-149
Arc Resistance		>180		-	-	ASTM D-495
Thermal Properties
Coefficient of Thermal Expansion - x		14	ppm/˚C	-	50˚C to 150˚C	IPC TM-650 2.4.41
Coefficient of Thermal Expansion - y		21	ppm/˚C	-	50˚C to 150˚C	IPC TM-650 2.4.41
Coefficient of Thermal Expansion - z		173	ppm/˚C	-	50˚C to 150˚C	IPC TM-650 2.4.24
Thermal Conductivity		0.26	W/(m.K)			ASTM E1461
Mechanical Properties
Copper Peel Strength		14	Lbs/in	10s @288˚C	35 μm foil	IPC TM-650 2.4.8
Young’s Modulus		517, 706	kpsi	23˚C @ 50% RH	-	ASTM D-638
Tensile Strength (MD, CMD)		19.0, 15.0	kpsi	23˚C @ 50% RH	-	ASTM D-882
Compressive Modulus		359	kpsi	23˚C @ 50% RH	-	ASTM D-695
Flex Modulus		537	kpsi	23˚C @ 50% RH		ASTM D-3039
Physical Properties
Flammability		V-0			C48/23/50 & C168/70	UL 94
Moisture Absorption		0.03	%	E1/105+D24/23		IPC TM-650 2.6.2.2
Density		231	g/cm³	C24/23/50	Method A	ASTM D792
NASA Outgassing	Total Mass Lost	0.02	%	125°C, ≤ 10-6 torr		NASA SP-R-0022A
	Collected Volatiles	0.00	%
	Water Vapor Recovered	0.01	%