Double-sided RF printed circuit board for LNCs with high frequency Rogers 30 mil 0.762 mm RO4350B without solder mask
Double-sided RF printed circuit board for LNCs with high frequency Rogers 30 mil 0.762 mm
RO4350B without solder mask
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
RO4350B hydrocarbon ceramic laminates are specially engineered to deliver exceptional high-frequency
performance while maintaining cost-effective circuit fabrication. As operating frequencies increase beyond
500 MHz, the selection of suitable laminates for designers becomes limited. However, RO4350B offers the
necessary properties for designing RF microwave circuits, matching networks, and controlled impedance
transmission lines.
Thanks to its low dielectric loss, RO4350B is ideal for applications where higher operating frequencies would
traditionally limit the use of conventional circuit board materials. This makes it a versatile choice for demanding
high-frequency environments.
Temperature Coefficient of Dielectric Constant: RO4350B exhibits one of the lowest coefficients
of dielectric constant among circuit board materials, ensuring stability over a wide frequency range.
Thermal Coefficient of Expansion (CTE): The material's CTE offers significant advantages for PCB
designers. Its expansion coefficient is similar to copper, leading to excellent dimensional stability
crucial for mixed dielectric multi-layer board constructions.
Low Z-axis CTE: The low Z-axis CTE of RO4350B ensures reliable plated through-hole quality,
even under severe thermal shock conditions, enhancing the overall durability of the PCB.
Glass Transition Temperature (Tg): With a Tg exceeding 280°C, RO4350B maintains stable expansion
characteristics across the entire range of PCB processing temperatures, contributing to the material's
reliability and performance during manufacturing processes.
PCB Specifications
| PCB SIZE | 93 x 92mm=1PCS |
| BOARD TYPE | |
| Number of Layers | Double sided PCB, 2 Layer PCB |
| Surface Mount Components | YES |
| Through Hole Components | YES |
| LAYER STACKUP | copper ------- 17.8um(0.5oz)+plate TOP layer |
| RO4350B 30mil (0.762mm) | |
| copper ------- 17.8um(1oz)+plate BOT Layer | |
| TECHNOLOGY | |
| Minimum Trace and Space: | 11.97mil |
| Minimum / Maximum Holes: | 0.3/2.8mm |
| Number of Different Holes: | 2 |
| Number of Drill Holes: | 195 |
| Number of Milled Slots: | 5 |
| Number of Internal Cutouts: | 0 |
| Impedance Control | No |
| BOARD MATERIAL | |
| Glass Epoxy: | RO4350B 30mil (0.762mm), Tg 288℃ |
| Final foil external: | 1oz |
| Final foil internal: | 0oz |
| Final height of PCB: | 0.8mm ±0.1 |
| PLATING AND COATING | |
| Surface Finish | Immersion Gold (16.2%) 2 micoinch over 100 microinch nickel |
| Solder Mask Apply To: | NO |
| Solder Mask Color: | NO |
| Solder Mask Type: | N/A |
| CONTOUR/CUTTING | Routing, Fiducial Marks |
| MARKING | |
| Side of Component Legend | NO |
| Colour of Component Legend | NO |
| Manufacturer Name or Logo: | N/A |
| VIA | Plated Through Hole(PTH) |
| FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
| DIMENSION TOLERANCE | |
| Outline dimension: | 0.0059" (0.15mm) |
| Board plating: | 0.0030" (0.076mm) |
| Drill tolerance: | 0.002" (0.05mm) |
| TEST | 100% Electrical Test prior shipment |
| TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
| SERVICE AREA | Worldwide, Globally. |
Typical applications are as follows:
Automotive Radar and Sensors
Cellular Base Station Antennas
Direct Broadcast Satellites
Low Noise Block
Power amplifiers
RFID
Data sheet of Rogers 4350 (RO4350B)
| RO4350B Typical Value | |||||
| Property | RO4350B | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 3.48±0.05 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline | |
| Dielectric Constant,εDesign | 3.66 | Z | 8 to 40 GHz | Differential Phase Length Method | |
| Dissipation Factortan,δ | 0.0037 0.0031 |
Z | 10 GHz/23℃ 2.5 GHz/23℃ |
IPC-TM-650 2.5.5.5 | |
| Thermal Coefficient of ε | +50 | Z | ppm/℃ | -50℃to 150℃ | IPC-TM-650 2.5.5.5 |
| Volume Resistivity | 1.2 x 1010 | MΩ.cm | COND A | IPC-TM-650 2.5.17.1 | |
| Surface Resistivity | 5.7 x109 | MΩ | COND A | IPC-TM-650 2.5.17.1 | |
| Electrical Strength | 31.2(780) | Z | Kv/mm(v/mil) | 0.51mm(0.020") | IPC-TM-650 2.5.6.2 |
| Tensile Modulus | 16,767(2,432) 14,153(2,053) |
X Y |
MPa(ksi) | RT | ASTM D 638 |
| Tensile Strength | 203(29.5) 130(18.9) |
X Y |
MPa(ksi) | RT | ASTM D 638 |
| Flexural Strength | 255 (37) |
MPa (kpsi) |
IPC-TM-650 2.4.4 | ||
| Dimensional Stability | <0.5 | X,Y | mm/m (mil/inch) |
after etch+E2/150℃ | IPC-TM-650 2.4.39A |
| Coefficient of Thermal Expansion | 10 12 32 |
X Y Z |
ppm/℃ | -55℃to288℃ | IPC-TM-650 2.4.41 |
| Tg | >280 | ℃ TMA | A | IPC-TM-650 2.4.24.3 | |
| Td | 390 | ℃ TGA | ASTM D 3850 | ||
| Thermal Conductivity | 0.69 | W/M/oK | 80℃ | ASTM C518 | |
| Moisture Absorption | 0.06 | % | 48hrs immersion 0.060" sample Temperature 50℃ |
ASTM D 570 | |
| Density | 1.86 | gm/cm3 | 23℃ | ASTM D 792 | |
| Copper Peel Stength | 0.88 (5.0) |
N/mm (pli) |
after solder float 1 oz. EDC Foil |
IPC-TM-650 2.4.8 | |
| Flammability | (3)V-0 | UL 94 | |||
| Lead-free Process Compatible | Yes | ||||
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