Vacuum Coating Chromium Sputtering Target High Corrosion Resistance
Customized By Drawing Chromium Plane Sputtering Target For Vacuum Coating Industry
Description
Sputtering is one of the main techniques for preparing thin film materials. It uses the ions generated by an ion source to accelerate and accumulate in a vacuum to form a high-speed energy ion beam,
bombard the solid surface, and exchange kinetic energy between the ions and the atoms on the solid surface. The atoms on the solid surface leave the solid and are deposited on the surface of the substrate.
The bombarded solid is the raw material for the deposition of thin films by sputtering, which is called the sputtering target. Various types of sputtered thin film materials have been widely used in semiconductor integrated circuits,
recording media, flat displays, and surface coatings of workpieces.
Chromium targets produced by Achemetal Tungsten & Molybdenum Co., Ltd. include chromium plane targets and chromium-niobium rotating targets.
The purity respectively includes: Cr99.5%,Cr99.7%,Cr99.8%,Cr99.9%,Cr99.95%.
Features of targets manufactured by Achemetal:
1. Due to the adoption of a hot isostatic pressing process, the product features high density, good compactness and uniform crystal grains.
2. Higher machining property
3. Relative density of targets: over 99%, relative density of alloy: over 97%; grain size: less than 50um; thermal resistance of films: below 5%;
welded rate with back plates: over 98%, film uniformity after target film formation: over 95%
| Chromium Target Parameters | ||
| Elements | Cr | |
| Purity | >99.5%(2N5) | |
| Sample size | Φ127mm×15mm | |
| Density | 7.19 g/cm3(HIP) | |
| Hardness | HV5:162-166 | |
| Grain size | 13μm | |
| Surface roughness | Ra≤0.4μm | |
| Impurity content (powder) | Fe | ≤1200ppm |
| Al | ≤1700ppm | |
| Si | ≤1400ppm | |
| S | ≤10ppm | |
| C | ≤60ppm | |
| O | ≤900ppm | |
| P | ≤30ppm | |
| Cu | ≤20ppm | |
| N | ≤100ppm | |
Note: all the specifications can meet the requirement of customers on high accuracy through machining.
Process flow
What is HIP process?
HIP is a short name of Hot isostatic Pressing. This technology is forming process combining simultaneous heating and pressing to consolidate powders in high temperature,
high pressure as well as under argon(Ar) atmosphere, primarily used to eliminate voids and defects in materials. HIP is mainly applied to a wide range of Materials,
it is the best fabrication methods for Cr targets and powder metallurgy aluminum alloy targets
.
Our chromium targets are mainly applied to:
Thin-film solar industry, touch control industry, glass industry, semiconductor industry, optical coating industry, surface decoration and tool coating industry.
Package Type:
Wooden box or as request, appropriate for exporting
Lead Time:
| Quantity(pieces) | 1 - 500 | >500 |
| Est. Time(days) | 15 | To be negotiated |
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.