Ruthenium Iridium Oxide Coated Titanium Anodes For Printed Circuit Board
Ruthenium-Iridium Mixed Oxides Coated Titanium Electrode For Printed Circuit Board (PCB)
| Main application areas | Anodes and coatings | Details |
| Cathodic Protection |
KERAMOX® Titanium anode Platinised Titanium Anodes based on Niobium or Tantalum |
All round applicable At high current densities, for example in sea water High voltages or strongly corrosive electrolytes |
| Seawater electrolysis |
KERAMOX® Titanium anode Titanium with a Ruthenium Mixed Metal Oxide coating Titanium with a Platinum-Iridium Oxide coating |
Depending on amongst others temperature and salinity |
| Electroplating |
Titanium with an Iridium Mixed Metal Oxide coating Platinised Titanium |
In highly acidic environments such as: Electro galvanising (zinc plating) Anodising of Aluminium Chromium, Nickel,Tin, etc. plating Precious metal plating Reverse pulse Copper plating Hard Chromium plating Precious metal plating |
| Water treatment |
Platinised Titanium Titanium with an Iridium Mixed Metal Oxide coating Boron-Doped-Diamond anodes |
Electro dialysis with polarity reversal Recovery of metals Oxidation and break-down of organic contaminations Higher overpotentials,amongst others for disinfection |
| Hypo chlorite & Disinfection |
Titanium with a Ruthenium Mixed Metal Oxide coating Titanium with an Iridium Mixed Metal Oxide coating Titanium with a Platinum-Iridium Oxide coating |
Depending on salinity, polarity reversal and current density |
| Synthesis reactions |
Platinised Titanium Titanium with an Iridium Mixed Metal Oxide coating Boron-Doped-Diamond anodes |
Depending on the particular reaction At higher overpotentials
|
| Hydrogen production | Nickel electrodes with a precious metal coating |
Coating process by means of exchange plating The purpose is to decrease the overpotentials |
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Hole metallizationand plating technology are widely used in PCB manufacturing procedure to solve the key problems of interlayer connection or conduction. In the process of acidic copper plating in PCB, special organic additives are added to obtian metal deposit layer with fine grain, uniform copper distribution on the board and preferable via filling ability. In this process, the coating design of insoluble titanium anode plays a role in ensuring the uniformity of current distribution and controlling the reasonable and effective additive consumption.
