Transparent Electronic Curing Silicone Potting Compound Flexible Adhesive ODM
HN-8808 two-component room temperature curing potting silicone
Product Specification
| №. | Items | Technique Request |
|---|---|---|
| 1 | Exterior | Transparent / White / Grey Liquid |
| 2 | Viscosity mPa.S (before curing) | A: 2000, B: 50 |
| 3 | Specific gravity (23℃) | 0.98 |
| 4 | In commission time (h, 25℃) | 1–2h |
| 5 | Entirely sulfuration time (min, 25℃) | 8–12h |
| 6 | Hardness (JIS A) | 25A |
| 7 | Volume resistivity (Ω·cm) | ≥1×10¹⁴ |
| 8 | Strength of breakdown voltage (kV/mm) | 18–25 |
| 9 | Dielectric constant (1MHz) | 2.5–3.0 |
| 10 | Dielectric loss (1MHz) | ≤4×10⁻³ |
| 11 | Thermal conductivity (W/m·K) | 0.1–0.20 |
Product Details
HN-8808 is a two-component room-temperature curing silicone specifically designed for the electronics industry. It offers excellent electrical properties and temperature resistance, making it ideal for PCB potting, sensor sealing, and LED encapsulation.
Key Advantages
High Insulation: Volume resistivity ≥1×10¹⁴ Ω·cm, breakdown voltage strength 18-25 kV/mm.
High-Temperature Resistance: Operating temperature range from -57°C to 250°C, suitable for high-temperature environments.
Fast Curing: Fully cures in 8-12 hours at room temperature, improving production efficiency.
Technical Parameters
Viscosity (Part A: 2000 mPa.S, Part B: 50 mPa.S)
Hardness (JIS A): 25A
Dielectric Constant (1MHz): 2.5-3.0
Thermal Conductivity: 0.1-0.20 W/m·K
Applications
PCB Potting: Protects circuit boards from moisture and vibration.
Sensor Sealing: Enhances durability and reliability of sensors.
LED Encapsulation: Provides excellent heat dissipation and insulation
Packing specifications
Component A: 10KG/20KG plastic barrel
Component B: 1KG plastic barrel
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