Fire Retardant High Temp Potting Epoxy Resin Industrial Sensors Lithium Battery Packs Inverters Epoxy Potting Glue
Fire Retardant High Temp Potting Epoxy Resin Industrial Sensors Lithium Battery Packs Inverters Epoxy Potting Glue
Product Description of epoxy potting compound:
Epoxy potting compound is a high-performance insulating and sealing material, mainly used to protect electronic components through potting, filling, or encapsulation, and cured at room temperature or by heating.
Epoxy potting compound is a thermosetting polymer sealant made from epoxy resin as a matrix, with the addition of curing agents, fillers, and additives. Its core characteristic is that it is poured into electronic components or devices in a liquid state, and then cures through a chemical reaction to form a hard, dense solid protective layer, achieving comprehensive encapsulation of internal components.
Product Features of epoxy potting compound:
With low viscosity, long operation time, good fluidity, and easy penetration into the clearance of the product; no bubbles after curing, smooth surface, luster, high hardness; curing materials have good acid and alkali resistance, moisture-proof, moisture, and air aging; curing materials have excellent insulation, compressive resistance, and bonding strength
Physical Properties of epoxy potting compound:
| efore curing | builder | Epoxy resin 5508 | Curing agent 5508 |
| pigment | Black / White et al | Ruburn / transparent surface | |
| A sticky epoxy resin water | r liquid specific | ||
| c gravity, g / cm3 | 1.4-1.5 | 1.05 | |
| Viscosity of 25℃ | 4,500—6,000cp s | 150—250cp storage | |
| e Period (25℃) | Six months | x months | |
|
processabili
|
mixing ratio | A: B =5:1 (weight ratio) | |
| Available for a time of 25℃ | 2-3H (100g mix) | ||
| curing time | 25℃ / 6-8H surface stem, 12-16H fully cured or 60-80℃/1.5-2H | ||
| After curing | 2 Tensile strength of kg/cm | 16-18 | |
| 2 Compressive strength of kg/cm | 18-22 | ||
| Resistance to the voltage of kv/mm | 20-22 | ||
| Surface resistance ofΩ-cm |
14 1.2*10 |
||
| Volume resistance ofΩ-cm |
15 1.1*10 |
||
| contraction percentage% | 0.35-0.55 | ||
| Water absorption rate was 25℃ * 24H | <0.03% | ||
| The hardness of SHORE A | 85-95 |
|
distortion temperature ℃ |
130-150 |
| low temperature resistant ℃ | -30 |
Product application of epoxy potting compound
HN-5508 is widely used in transformers, resistors, filters, temperature sensors, temperature controllers, ignition coils, high voltage packs, aquarium equipment, anion generators
Package of epoxy potting compound:
This product is 40KG per group;
Component A is 20KG (in barrels), and Component B is 20KG (in barrels)
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