Heavy-Duty Epoxy Potting Glue For Transformers, Sensors & PCB | Premium Insulating & Moisture-Proof Resin
Price:
Negotiable
MOQ:
1 kilogram
Delivery Time:
5-7days
Brand:
Hanast
Product Description
Heavy-Duty Epoxy Potting Glue For Transformers, Sensors & PCB | Premium Insulating & Moisture-Proof Resin
Description of Epoxy Potting Compound
HN-5508 is a premium, low-viscosity epoxy resin designed for high-performance potting, encapsulation, and sealing applications. Engineered to cure reliably at room or low temperatures, it features an extended working time and exceptional flowability. This allows the liquid resin to easily penetrate tight gaps, intricate clearances, and complex component geometries without trapping air.
technical parameter of epoxy potting compound:
| efore curing | builder | Epoxy resin 5508 | Curing agent 5508 |
| pigment | Black / White et al | Ruburn / transparent surface | |
| A sticky epoxy resin water | r liquid specific | ||
| c gravity, g / cm3 | 1.4-1.5 | 1.05 | |
| Viscosity of 25℃ | 4,500—6,000cp s | 150—250cp storage | |
| e Period (25℃) | Six months | x months | |
|
processabili
|
mixing ratio | A: B =5:1 (weight ratio) | |
| Available for a time of 25℃ | 2-3H (100g mix) | ||
| curing time | 25℃ / 6-8H surface stem, 12-16H fully cured or 60-80℃/1.5-2H | ||
| After curing | 2 Tensile strength of kg/cm | 16-18 | |
| 2 Compressive strength of kg/cm | 18-22 | ||
| Resistance to the voltage of kv/mm | 20-22 | ||
| Surface resistance ofΩ-cm |
14 1.2*10 |
||
| Volume resistance ofΩ-cm |
15 1.1*10 |
||
| contraction percentage% | 0.35-0.55 | ||
| Water absorption rate was 25℃ * 24H | <0.03% | ||
| The hardness of SHORE A | 85-95 |
|
distortion temperature ℃ |
130-150 |
| low temperature resistant ℃ | -30 |
Product Features of epoxy potting compound:
HN-5508 is engineered with a comprehensive suite of protective properties to ensure long-term reliability for sensitive electronics:
- Electrical Integrity: Combined flame-retardant formulation with high dielectric strength for premium insulation.
- Structural Bonding: High-strength adhesion that provides durable encapsulation and tight perimeter sealing.
- Dynamic Cushioning: Superior resistance to moisture absorption, humidity, impact shocks, and industrial vibrations.
- Thermal Stability: Engineered to withstand temperature fluctuations and environmental degradation without cracking.
Application of epoxy resin potting:
HN-5508 is engineered for high-performance potting and encapsulation across a broad range of electronic industries. Typical applications include:
- Power & Inductive Components: Transformers, resistors, filters, ignition coils, and high-voltage flyback transformers (high-voltage packs).
- Sensors & Controls: Temperature sensors, thermistors, and temperature controllers or thermostats.
- Submersible & Aquatic Equipment: Aquarium equipment, water pumps, and waterproof aquatic electronics.
- Specialized Electronic Devices: Negative ion (anion) generators, ultrasonic atomizers, and various sensitive electronic modules.
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Physical Properties of epoxy potting compound:
| fore curing | builder | Epoxy resin 5508 | Curing agent 5508 |
| pigment | Black / White et al | Ruburn / transparent surface | |
| A sticky epoxy resin water | r liquid specific | ||
| c gravity, g / cm3 | 1.4-1.5 | 1.05 | |
| Viscosity of 25℃ | 4,500—6,000cp s | 150—250cp storage | |
| e Period (25℃) | Six months | x months | |
|
processabili
|
mixing ratio | A: B =5:1 (weight ratio) | |
| Available for a time of 25℃ | 2-3H (100g mix) | ||
| curing time | 25℃ / 6-8H surface stem, 12-16H fully cured or 60-80℃/1.5-2H | ||
| After curing | 2 Tensile strength of kg/cm | 16-18 | |
| 2 Compressive strength of kg/cm | 18-22 | ||
| Resistance to the voltage of kv/mm | 20-22 | ||
| Surface resistance ofΩ-cm |
14 1.2*10 |
||
| Volume resistance ofΩ-cm |
15 1.1*10 |
||
| contraction percentage% | 0.35-0.55 | ||
| Water absorption rate was 25℃ * 24H | <0.03% | ||
How to use epoxy potting compound:
- Surface Prep: Clean and dry the substrate thoroughly.
- Weigh & Mix: Combine Part A and Part B at a strict 5:1 weight ratio. Stir well for 2–3 minutes.
- Degas: Vacuum de-air for 3–5 minutes to remove bubbles.
- Apply & Cure: Pour slowly and allow to cure at room temperature or accelerate with heat.
Package of epoxy potting compound:
25kg/barrel
Precautions & Handling Instructions of epoxy potting compound:
- Ratio: Strict weight ratio only (do not measure by volume).
- Mixing: Use a flat spatula or mechanical mixer; do not use round rods.
- Storage: Store in a cool, dry, dust-free environment. Seal tightly after opening.
- Testing: Data listed is measured at 25°C / 60% humidity for customer reference.
- Crystallization: If crystallized by moisture/cold, heat in a low-temperature oven to recover
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Company
Shenzhen Hanast New Material co.,LTD
Location
Units 1210-1211, Block B, Building 6, Hengda Fashion Valley, Dalang Street, Longhua District, Shenzhen, Guangdong Province, China
Contact Person
Candy