Dowsil SE-4485L 2.8 Coefficient Thermal Conductivity
Product Overview
DOWSIL™ SE 4485 is a single-component, white, moisture-cure thermal adhesive designed for efficient heat dissipation in electronic modules. Its key attributes include:
- Formulation: Filled with thermally conductive fillers and based on polydimethylsiloxane (PDMS) binder.
- Curing: Cures at room temperature (25°C) within 4–7 hours under 0–80% relative humidity.
- Certifications: UL94 V-0 flammability rating ensures safety in electronic applications.
- Color: White for aesthetic compatibility in visible applications.
Product Introduction
This thermal adhesive serves as a reliable "thermal bridge" to transfer heat from high-power components (e.g., LEDs, communication devices) to heat sinks or enclosures. Its unique properties include:
- Low Stress: Flexible cured silicone rubber minimizes mechanical stress on sensitive electronics.
- Moisture Resistance: Exhibits strong adhesion to metals, glass, and ceramics without requiring primers (though optional primers improve bonding on inert plastics like Teflon).
- Thermal Performance: Delivers a thermal conductivity of 2.8 W/m·K (1.62 BTU/hr·ft·°F), reducing hotspots and enhancing device reliability.
- Ease of Use: Semi-fluid consistency allows precise dispensing via automated or manual methods.
Specialized Attributes
Beyond standard specifications, SE 4485 stands out with:
- Fast Curing: Achieves tack-free surface in just 10 minutes at 25°C, accelerating production cycles.
- High Strength: Offers 492 psi (3.4 MPa) tensile strength and a Shore A hardness of 90 (JIS 1), balancing flexibility and durability.
- Chemical Stability: Resists degradation from solvents and maintains performance across a wide temperature range (-45°C to 200°C / -49°F to 392°F).
- Environmentally Friendly: Free of corrosive byproducts during curing, aligning with eco-conscious manufacturing practices.
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DOWSIL™ SE 4485 Thermal Conductive Adhesive Product Introduction
Product Overview
DOWSIL™ SE 4485 is a single-component, white, moisture-cure thermal adhesive designed for efficient heat dissipation in electronic modules. Its key attributes include:
- Formulation: Filled with thermally conductive fillers and based on polydimethylsiloxane (PDMS) binder.
- Curing: Cures at room temperature (25°C) within 4–7 hours under 0–80% relative humidity.
- Certifications: UL94 V-0 flammability rating ensures safety in electronic applications.
- Color: White for aesthetic compatibility in visible applications.
Product Introduction
This thermal adhesive serves as a reliable "thermal bridge" to transfer heat from high-power components (e.g., LEDs, communication devices) to heat sinks or enclosures. Its unique properties include:
- Low Stress: Flexible cured silicone rubber minimizes mechanical stress on sensitive electronics.
- Moisture Resistance: Exhibits strong adhesion to metals, glass, and ceramics without requiring primers (though optional primers improve bonding on inert plastics like Teflon).
- Thermal Performance: Delivers a thermal conductivity of 2.8 W/m·K (1.62 BTU/hr·ft·°F), reducing hotspots and enhancing device reliability.
- Ease of Use: Semi-fluid consistency allows precise dispensing via automated or manual methods.
Application Scenarios
SE 4485 is ideal for scenarios demanding efficient heat management, including:
- Consumer Electronics: Cooling LED lighting systems, smartphones, and laptops.
- Industrial Equipment: Power supplies, automotive electronics, and telecom devices.
- Emerging Technologies: Electric vehicle battery modules and renewable energy systems.
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.