Product Introduction​​

DOWSIL™ TC-5288 is a blue-colored, solvent-free thermal interface material (TIM) designed for efficient heat dissipation in high-performance electronics. Its flowable formulation allows easy application and thin bond line formation (<0.007mm at 40 psi), ensuring optimal thermal transfer from heat-generating components to heat sinks. The non-curing, oven-free process reduces production complexity, while its blue hue enables precise visual alignment during assembly. With exceptional thermal conductivity (2.9 W/m·K) and ultra-low thermal resistance, this material is ideal for demanding thermal management applications.

Special Attributes​​

• ​​Ultra-Thin Bond Line​​: Achieves ​​0.007mm BLT​​ at standard pressure, minimizing thermal gaps for high-efficiency cooling.
• ​​Solvent Resistance​​: Exhibits basic tolerance to intermittent solvent exposure, though prolonged contact is not recommended.
• ​​Wide Temperature Stability​​: Maintains performance from ​​-40°C to 200°C​​, ensuring reliability in extreme environments.
• ​​Electrical Safety​​: Offers ​​8.9 kV/mm dielectric strength​​ and ​​6×10¹¹ Ω·cm volume resistivity​​, protecting sensitive circuits.
• ​​Non-Curing​​: Eliminates the need for post-application curing, streamlining manufacturing workflows.