Shenzhen Huazhisheng New Material Technology Co., Ltd.
                                                                                                           
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8 Years
Since 2018
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Momentive INVISISIL RTV615 Electronic & Food-Grade Silicone Encapsulant

Price Negotiable
Price: CN¥13,213.73/sets 1-9 sets
MOQ: 1
Delivery Time: 5-8days
Brand: Momentive
Product Description

Momentive INVISISIL RTV615 Electronic & Food-Grade Silicone Encapsulant

Product Properties

Property Value
Uncured Viscosity 4,300 cps (Component A)
Specific Gravity 1.02 (Component A)
Mixed Viscosity 4,000 cps
Work Time @25°C 4 hours
Cure Time @25°C 6-7 days (full cure)
Hardness (Shore A)​ 44
Tensile Strength 65 kg/cm² (920 psi)
Elongation 120%
Shrinkage 0.2%
Dielectric Strength 19.7 kV/mm (500 V/mil)
Volume Resistivity 1.8×10¹⁵ ohm·cm
Temp. Range -60°C to 204°C (-75°F to 400°F)

Product Description

INVISISIL™ RTV615 Silicone Rubber Compound, developed and manufactured by Momentive Performance Materials, is specifically designed for electronic potting and encapsulation applications requiring reliable protection and optical clarity. Supplied as a two-component kit (Part A + Part B), it ensures accurate ratio and ease of use. The mixed system maintains manageable viscosity (approx. 4000 cps) and remains easily pourable, facilitating flow around intricate parts. At 25°C (77°F), the mixed compound offers a work time of approximately 4 hours, providing ample processing time. Curing occurs at room temperature (requiring about 6-7 days for optimum properties) or can be significantly accelerated with heat (e.g., 1 hour at 100°C/212°F).

Specialized Attributes

Thermal & Electrical Stability
Maintains elastomeric properties from -60°C to 204°C with consistent dielectric strength (19.7 kV/mm) and ultra-high volume resistivity (1.8×10¹⁵ ohm·cm). Low shrinkage (0.2%) ensures dimensional accuracy in precision encapsulation.

Processing Advantages
No solvent content enables clean production line operation. Deep-section curing occurs without exotherm, and pot life extends to 4 hours at 25°C. Accelerated curing is achievable at elevated temperatures (e.g., 1 hour @100°C).

Application Scenarios

1. Electronic Encapsulation
Used for potting sensitive PCBs and sensors requiring optical clarity for component inspection. Example: Encapsulation of automotive sensors in BMW control modules (Source: Electronics Weekly Case Study 2021).

2. Solar Energy Components
FDA-compliant formulation (per TDS) allows potting solar cell connectors in residential PV systems, maximizing light transmission while resisting UV

FAQ

1. Who are we?

We are Shenzhen Huazhisheng New Material Technology Co., Ltd., a professional industrial adhesives and sealants supplier based in China since 2018. we serve global markets: Mainland China (60%), Southeast Asia (20%), North America (10%), and Europe (10%).

 

2. What products do you offer?

we supply high-performance adhesives and sealants from global leaders including:

Cemedine, Dow Corning, Shin-Etsu, Araldite, and Momentive,etc.

 

3. How do you guarantee product quality?

Quality assurance through:

Mandatory pre-production samples approval

Final inspection by QC team before shipment

International certifications: SGS, UL, FDA, RoHS, REACH

 

4. Why choose us over other suppliers?

Reliable Supply:Authentic products from top manufacturers

Expert Support:Technical guidance for product selection

Global Compliance:Certifications meeting target market standards

Efficient Service:Customized solutions & professional support

 

5. What services do you provide?

Delivery​:EXW/FOB/CIF

Payment​:USD/EUR/CNY/HKD via T/T, L/C

Support​:Technical consultation & logistics coordination

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Shenzhen Huazhisheng New Material Technology Co., Ltd.
Location 101, No. 130 Fengping Road, Shitouling Industrial Zone, Wulian Village, Fenggang Town, Dongguan City, Guangdong Province, China
Contact Person ouyang

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