Dowsil TC-5860 High Thermal Conductivity High Dielectric Strength Solvent-Free Thermally Conductive Compound for Electronics

Dowsil TC-5860 is a one-part, gray, non-curing grease-like thermally conductive compound. It features high thermal conductivity, high dielectric strength, and a solvent-free stable formulation, designed to simplify production and ensure long-term reliability.

Dowsil TC-5860 Thermally Conductive Compound is a grease-like material highly loaded with thermally conductive fillers in a silicone matrix. It is designed to create an efficient thermal bridge between the heat source (e.g., chip) and the heat sink by reducing the thermal resistance at the interface, thereby improving heat transfer. This is crucial for modern high-power electronics, which continuously pursue higher performance and more compact designs, as it effectively lowers operating temperatures, enhancing efficiency and extending service life.

A key special attribute of this product is its solvent-free formulation. This ensures outstanding material stability after the container is opened, with no change in viscosity over time, guaranteeing consistent and easy application, whether through automated dispensing or stencil printing. Furthermore, its non-curing nature allows it to remain flexible throughout the device's lifespan, adapting to thermal expansion and contraction to maintain optimal interfacial contact.

Dowsil TC-5860 is widely used in various high-power electronics requiring efficient thermal management. Typical application scenarios include:

• Power converters
• Automotive electronic control units (ECUs)
• Cooling for server CPUs/GPUs
• Industrial drive inverters
• High-power LED lighting systems

It is particularly suitable for applications demanding thin bond line thicknesses (BLT) to maximize heat dissipation efficiency.