DOWSIL™ TC-5628 Thermal Grease with 4.0W/m·K Thermal Conductivity, UL 94 V-0 Flammability Rating, and 150°C RTI Temperature
DOWSIL™ TC-5628 is a one-part, blue, thermally conductive grease designed for electronics thermal management. This advanced thermal interface material (TIM) features excellent thermal conductivity (4.0 W/m*K) and low thermal resistance (0.178 cm²*K/W at 40 psi), making it highly efficient for heat dissipation applications.
- High thermal conductivity: 4.0 W/m*K
- Low thermal resistance: 0.178 cm²*K/W at 40 psi
- UL 94 V-0 flammability rating
- Relative Thermal Index (RTI) of 150°C
- Excellent resistance to pump-out and slump
- Suitable for dispensing or printing applications
- 12-month shelf life when stored at or below 25°C
| Test Standard | Property | Unit | Value |
|---|---|---|---|
| - | Type | - | One-part |
| - | Color | - | Blue |
| ASTM D4287 | Viscosity @ 5 RPM | cP | 72,400 |
| ASTM D70 | Specific Gravity (Uncured) | - | 3.26 |
| ISO 22007-2 | Thermal Conductivity | W/m*K | 4.0 |
| ASTM D5470 | Thermal Resistance @ 40 psi | cm²*K/W | 0.178 |
| - | Bond Line Thickness (BLT) | μm | 40 |
| ASTM D149 | Dielectric Strength | kV/mm | 12 |
| ASTM D257 | Volume Resistivity | Ω*cm | 3.6E+12 |
| UL94 | Flammability | - | V-0 |
| UL94 | RTI Temperature | °C | 150 |
| - | Shelf Life (≤25°C) | Month | 12 |
DOWSIL™ TC-5628 boasts a high viscosity of 72,400 cP, which contributes to excellent application stability and the ability to maintain a thin Bond Line Thickness (BLT) of 40 μm. The product achieves a UL 94 V-0 flammability rating and has a Relative Thermal Index (RTI) of 150°C, indicating superior high-temperature endurance. Additionally, it provides excellent electrical insulation properties with a dielectric strength of 12 kV/mm and volume resistivity of 3.6×10¹² Ω*cm.
This thermal grease is widely used in thermal management for various electronic devices, including smartphones, laptops, servers, LED lighting systems, automotive power electronics, and telecommunications equipment. Its dispenseable or printable nature makes it suitable for both manual and automated high-volume assembly lines, ensuring efficient heat dissipation in compact and high-power density applications.
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