Shin-Etsu X-23-8195-4 High Performance Silicone Thermal Grease for CPU GPU Heat Dissipation Interface Material
Shin-Etsu MicroSi X-23-8195-4 is a one-part, solvent-free silicone-based thermal grease filled with spherical ceramic particles (Al₂O₃ and ZnO), formulated as a non-electrically conductive Thermal Interface Material (TIM) for semiconductor heat dissipation.
| Item | Specification | Unit / Note |
|---|---|---|
| Product Name | Shin-Etsu MicroSi X-23-8195-4 | — |
| Base Resin | Silicone (Polydimethylsiloxane) | — |
| Filler | Spherical Al₂O₃, ZnO (Ceramic) | Non-electrically conductive |
| Appearance | Grayish paste / grease | — |
| Thermal Conductivity (λ) | 4.6 | W/m·K |
| Minimum BLT (Bond Line Thickness) | 14 – 17 | µm |
| Thermal Resistance @ Min BLT | 3.7 – 4.0 (typ. 4.0) | mm²·K/W |
| Interface Resistance (measured) | ~5.2 | mm²·K/W |
| Viscosity (@25°C) | 90 | Pa·s |
| Specific Gravity (@25°C) | 2.5 | — |
| Operating Temperature Range | -30 to +150 | °C |
| Volatile Content (@150°C, 24h) | ≤ 0.15 | % |
| Max Filler Particle Size | ≤ 17 (typ. ≤10) | µm |
| Solvent Content | None (Solvent-free formulation) | — |
Developed as an evolution of earlier Shin-Etsu OEM pastes (X-23-7921-5 / X-23-7783D), the X-23-8195-4 features thixotropic medium viscosity and tightly controlled filler particle size distribution, allowing it to be spread into an extremely thin, stable bond line between a processor IHS/die and its heatsink. It exhibits minimal pump-out tendency, low bleed, and stable long-term thermal performance under cyclic heating—qualities that made it a popular choice in OEM server and high-end consumer cooling applications before it entered the retail market.
The X-23-8195-4 is engineered for industrial reliability: its spherical ceramic fillers permit a minimum achievable Bond Line Thickness (BLT) of ~14–17 µm under typical mounting pressure (tested at 9 N/cm² by igor'sLAB), yielding a low interface thermal resistance (~4.4–5.2 mm²·K/W). The paste is electrically insulating, contains no volatile solvents (volatile content <0.15% @150°C/24h), and resists siloxane outgassing and phase separation—making it suitable for clean-room and repeated thermal cycling environments.
- Originally designed for BGA packages, GPUs, flip-chip dies and lidded processors, the X-23-8195-4 is widely used in:
Desktop/NB CPU & GPU cooling (between IHS and heatsink base) - Server / data-center processor thermal management
- Automotive ECU and power module heat dissipation
- Industrial semiconductor devices requiring thin-BLT, non-conductive TIM
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